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Flexible Printed Circuit Board(基板) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
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Flexible Printed Circuit Board Product List

31～38 item / All 38 items

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FPC/Flexible Printed Circuit Board

FPC/Flexible Printed Circuit Board

Short delivery times and small lot sizes! Supports high-quality and high-performance specifications such as high flexibility and impedance control.

Asunics collaborates with Taiwanese FPC manufacturers to provide high-quality and short-lead-time FPCs. We support high-quality and high-performance specifications such as high flexibility and impedance control. We provide speedy support from component mounting, bump and Gerber data creation assistance, to prototyping and mass production. 【Features】 ■ Materials: Polyimide / Liquid Crystal Polymer, etc. ■ High-speed signal support: LVDS / HDMI / USB / MIPI ■ Short lead time / Small lot *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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Flexible printed circuit board [Reel to Reel method]

Flexible printed circuit board [Reel to Reel method]

We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!

We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Other electronic parts

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Introduction of high-performance FPC made in China

Introduction of high-performance FPC made in China

Flexible printed circuit boards with high quality and technology achieved at low prices through guidance from a Japanese team.

Strict calibration of equipment and completion of UL certification for materials. Suzhou Zhengxin Electronic Technology Co., Ltd. maximizes the above features to provide customers with both "Japanese standard" quality and responsiveness, as well as "Chinese standard" pricing. ＝＝＝＝＝You can also view samples of FPC in the electronic book below＝＝＝＝＝

  • Other semiconductors

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Flexible Printed Circuit Board "Low-Rebound FPC"

Flexible Printed Circuit Board "Low-Rebound FPC"

Customize softness! We offer a variety that meets low rebound needs!

We have revamped the lineup of Maruwa Manufacturing's thin FPC representative brand "MK Series" to offer variations that meet the demand for low rebound. Here are solutions for making devices thinner and more compact. 【Applications】 ○ Suppressing springback in thin LCD modules, etc. ○ Sliding applications in compact areas such as small camera modules, etc. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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BigElec Fold - High Current Flexible Circuit Board - New Product

BigElec Fold - High Current Flexible Circuit Board - New Product

BigElec Fold - Customize flexible high-current wiring at a reasonable price.

BigElec Fold is a flexible and cost-effective high-current wiring solution that serves as an alternative to busbars and wire harnesses. ■ Features - Thin and flat printed circuit board structure - Customizable according to the desired shape and applied current of the customer - Two-layer construction allows for cost reduction and bending processing BigElec Fold emphasizes cost performance by limiting itself to a two-layer structure instead of a multi-layer one. This reduces material costs and makes bending processing easier, allowing for folding as well. BigElec Fold can connect to multiple terminals in its flat state, and by folding the wiring, it can also be accommodated in tight spaces. It can be freely designed and folded according to the application and wiring space. It realizes innovative ideas in the design field and provides excellent cost performance. BigElec Fold paves the way for the next stage of high-current wiring and meets customer expectations.

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  • spec.jpg
  • Printed Circuit Board

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One-stop service for FPC production <Presentation of explanatory materials with a glossary>

One-stop service for FPC production <Presentation of explanatory materials with a glossary>

Consistent support from development design to parts procurement, manufacturing, implementation, and assembly with short delivery times. Capable of small lot and diverse prototype and mass production.

Our company handles everything from the design to manufacturing and assembly of FPC (Flexible Printed Circuit Boards) in a one-stop service. We can flexibly respond to a wide range of needs, including prototypes and development trials, one-off and irregular orders, and mass production, all with short delivery times. Since we use sheet materials, we can produce small lots without a minimum quantity requirement. The initial lead time for mass production is at least three weeks. We thoroughly manage quality using various inspection equipment, and we have a wealth of experience in fields with particularly high quality demands, such as automotive and medical applications. 【Features】 ■ Shortened lead times for product development and reduced development costs through small-lot prototyping ■ Rapid startup during mass production and flexible responses to production lot variations ■ Comprehensive support from design to board assembly (mounting support and in-house metal mask manufacturing) ■ Support for component procurement for both prototypes and mass production ■ Proposals for appropriate methods and tools (jigs) for FPC manufacturing from production planning ★ Currently, we are offering a glossary of FPC-related terms and materials about our products. Please check it out via "PDF Download." Feel free to contact us with any inquiries.

  • Contract manufacturing

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FPC - "Technical Information" - Updated September 2025

FPC - "Technical Information" - Updated September 2025

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

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  • 透明FPC.png
  • Printed Circuit Board

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[Exhibition Report] We exhibited at JPCAshow 2025!

[Exhibition Report] We exhibited at JPCAshow 2025!

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering 　　>> There are multiple important processing steps in FPC manufacturing. 　　　　Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. 　　　　We have introduced the "strengths" we have cultivated over many years in each process: 　　　　　<Design>　　 Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Processing> High-precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High-precision contour processing ±50μm, a variety of tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing 　　>> Normally, there are no opportunities to see anything other than the finished product, 　　　　but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. 　　　　　*Through-hole drilling, exposure/development, etching, contour processing, etc.

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots

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