三井金属鉱業 Product Lineup

"Mitsui's thick copper foil" is a type of copper foil that can reduce the risk of CAF occurrence. Low roughness copper foil prevents contact between the copper foil and glass cloth, thereby reducing the risk of CAF occurrence during high-temperature and high-humidity processing. We offer two types in our lineup: standard roughness and low roughness. Please feel free to consult us. [Features] - Prevents contact with glass cloth - Can reduce the risk of CAF occurrence *For more details, please refer to the catalog or feel free to contact us.

• Machine elements
• Other electronic components and modules

"Super-HTE" is a high-flexibility electrolytic copper foil suitable for mass production of flexible printed circuit boards at 9μm. Like rolled copper foil, it can achieve high elongation through annealing and recrystallization. Among them, "3EC-M1S-HTE" has achieved a low roughness of Rz=2.0μm or less due to improvements in surface treatment. We offer a wide range of products to suit various applications. Please feel free to consult us. 【Features】 ■ For flexible printed circuit boards ■ Capable of mass production at 9μm ■ Low roughness ■ Extensive lineup *For more details, please refer to the catalog or feel free to contact us.

• Machine elements
• Other electronic components and modules

This catalog is the product catalog of Mitsui Mining & Smelting Co., Ltd., which is engaged in the perlite business and other activities. It includes a variety of electronic materials such as "MGF (MultiFoil G)," "carrier-attached ultra-thin electrolytic copper foil" with a thickness of 18μm, "substrate-integrated capacitor materials," and "substrate-integrated capacitor materials for RF modules." Please take a look. [Contents] ■ Electronic materials handled, etc. *This catalog contains sections written in English. *For more details, please refer to the catalog or feel free to contact us.

• Other electronic components and modules
• Machine elements