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Manufacturing and processing contract
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アレイ

EstablishmentMarch 1, 2001
capital3250Ten thousand
number of employees14
addressKanagawa/Fujisawa-shi/3rd Floor, Mitsui Sumitomo Insurance Fujisawa Building, 17-15 Nandazawa
phone0466-86-5411
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last updated:May 10, 2024
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アレイ List of Products and Services

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China-Russia Bank

Specialized service for manufacturing medium-sized PCBs of 1 to 5 square meters.

In this service, we have clearly defined "1 to 5 square meters" as the medium lot. If it falls within this manufacturing range, we can produce medium lot PCBs with short lead times, high quality, and low prices. You can easily diagnose whether it qualifies as a medium lot PCB, so please give it a try.

  • Printed Circuit Board

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Artwork design for high-frequency substrates

We accept artwork design for various types of circuit boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency PCBs ranging from 10GHz to 40GHz and high-speed transmission PCBs from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component assembly and propose the optimal layout.

  • Image Processing Software

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Artwork design for analog boards, power boards, and single-sided boards.

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting to propose the optimal layout.

  • others

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Substrate manufacturing, substrate materials, special processing achievements

We handle various types of substrates. We also accept inquiries regarding base materials and substrate processing.

Substrate materials FR-4, EL230T, HL950SK, MCL-FX-II, MEGTRON6, MCF-5000I, FPC, and others.

  • others

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Component assembly prototype, medium lot assembly

We select the most suitable factory based on the implementation details in the array, so we can accommodate a wide range of requests.

Deposit and hand placement implementation Mounting implementation Metal mask manufacturing in one day

  • others

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Component Assembly Achievements

We select the most suitable factory based on the implementation details in the array, so we can accommodate a wide range of requests.

BGA (0.4mm pitch), CSP (memory, diode) → Implementation X-ray inspection compatible double-sided BGA, 0402 size implementation.

  • others

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Component mounting, COB mounting

We select the most suitable factory based on the implementation details in the array, so we can accommodate a wide range of requests.

Wire bonding, flip chip → Compatible with X-ray inspection for assembly

  • others

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Component mounting, lead-free mounting

We select the most suitable factory based on the implementation details in the array, so we can meet a wide range of requests.

Lead-free dip tank Mounting possible with specified solder materials N2 reflow

  • others

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Component mounting universal wiring

We select the most suitable factory based on the implementation details in the array, so we can meet a wide range of requests.

Layout considering circuit characteristics Wiring with a beautiful finish

  • others

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Component assembly rework

We select the most suitable factory based on the implementation details in the array, so we can meet a wide range of requests.

BGA, CSP rework and reballing IC (SOP, QFN, QFP) Aerial wiring Jumper wiring, pattern cutting

  • others

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Array component procurement

Our dedicated staff will procure from our network of over 150 companies both domestically and internationally.

We can search for parts starting from just one piece.

  • others

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Printed circuit board design high-frequency board

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

  • others

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Printed circuit board design: analog boards, power boards, single-sided boards.

We accept artwork design for various types of PCBs, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

  • others

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Flexible printed circuit board (FPC) design, prototyping, small lot, impedance

Impedance control of flexible substrates and UL certification can be achieved with short lead times and the ability to manufacture small quantities.

We can respond to circuit board manufacturing and component mounting in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We also accommodate small lot production. Please feel free to consult with us.

  • others

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High-performance module design development CR-5000

[High Performance] High Frequency (Co., Ltd.) Array! Supports shortening the development cycle through module design with CR-5000/Board Designer.

In the array, we have already introduced CR-5000/BoardDesigner, which has stabilized the split design function and allowed for the transfer of pre-revision design data. We will form beautifully rounded flat planes, work to prevent antenna effects, and implement noise reduction and immunity measures from the prototype stage. Additionally, with the spread of development devices featuring flip chips and bare chips connected through wire bonding and stud bump connections, we intend to flexibly respond to substrate and mechanical development while focusing on three-dimensional mounting technology and modularization. Moving forward, we would be grateful if you could engage with us not only as a "high-frequency array" but also as a "high-performance module array."

  • Prototype Services
  • others
  • 2D CAD Electrical

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Ultra Fast SI Simulation HyperLynx

[Super Fast] Quick delivery support by Array Inc.! Launching SI simulation to enhance development capabilities for prototyping and evaluation.

At Array, we have already begun SI simulation transmission line analysis to further accelerate the shortening of the development cycle. Recently, due to the increasingly compressed development environment and the acceleration of diverse technologies, the need for cost reduction and shortening of the development cycle has become more critical. Array will continue to provide solutions to these challenges for our customers. Additionally, not only for one-time operations but also as data for revisions, we have quantified the evaluation results even in commercially available states, allowing for recognition of margins. Moving forward, we hope to be engaged not only as "Array for short delivery times" but also as "Array for ultra-fast SI analysis."

  • Prototype Services
  • others

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Rigid flex circuit design

We also accept prototypes and small lot production of rigid-flex PCBs from AW design.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

  • Prototype Services
  • others

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Rigid flex circuit prototype

We also accept prototype and small lot production of rigid-flex PCBs from AW design.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

  • Prototype Services
  • others

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Rigid flex circuit small lot

We also accept prototype and small lot production of rigid-flex PCBs from AW design.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

  • Prototype Services
  • others

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Rigid flex circuit impedance

We also accept prototyping and small lot production of rigid-flex PCBs from AW design at our array.

By combining rigid substrates with bendable flexible substrates, various layouts become possible.

  • Prototype Services
  • others

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Flexible printed circuit board (FPC) impedance control

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We can respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • Prototype Services

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Flexible printed circuit board (FPC) short delivery time

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.

  • others

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

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Design PCB Assembly High Frequency Design Array

Array pursues quality in high-frequency design and ultra-short delivery times.

Our high-frequency design array has established an "Inspection Room" in-house for the past ten years. We believe that communication with our customers during the pattern design stage is very important, especially in the constrained environment of circuit board manufacturing. We are grateful that many customers visit us daily for pattern checks. The array aims to be a refuge for customers facing issues with their circuit boards, offering simpler and new proposals, starting with BGA conversion boards. This problem-solving know-how enables us to achieve ultra-short delivery times, improve the quality of assembled boards, and reduce costs. Leveraging our strength in total support from design to component assembly, we will continue to work together as a team to be of service to our customers. We look forward to your continued guidance. 【Features】 - 24-hour support on weekends with ultra-short delivery times - Accumulation of high-frequency design know-how - Support for prototype development using cutting-edge technology - One-stop service from design to assembly For more details, please contact us or download our catalog.

  • High frequency/microwave parts

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