日本化学工業 Product Lineup

"Smurf" is a one-component heat-curing epoxy adhesive for RFID inlays. By using our metal-coated powder, high reliability is achieved. Curing can be completed in as little as 1 to 2 seconds. Additionally, viscosity can be adjusted depending on the application method, such as jetting or dispensing. Furthermore, by employing special conductive particles, high reliability is maintained even in high-temperature and high-humidity tests and thermal cycling tests. 【Features】 - For RFID inlays - One-component heat-curing - Viscosity adjustment possible through application methods such as jetting and dispensing - One-component thermosetting epoxy adhesive with no volatile components, making it easy to handle - Excellent adhesion to various materials such as Al, Cu, Ag, PET, and PI *For more details, please refer to the PDF document or feel free to contact us.

• glue

"Cure Light" is a material for printed electronics that can be cured in a short time under atmospheric conditions. It allows for wiring formation on low-heat-resistant substrates (such as PET film and paper). It has good adhesion to various substrates. It can be used for applications such as RFID tags, touch panels, various sensors, flexible circuits, and electromagnetic shielding. 【Features】 - For printed electronics - Low volume resistivity - Capable of fine line printing - Good adhesion to various substrates - Good storage stability *For more details, please refer to the PDF document or feel free to contact us.

• Other metal materials

At Nippon Chemical Industrial, we handle "Functional Phosphates for Small All-Solid-State Batteries." We use our own phosphates and have developed phosphate active materials and solid electrolytes through our unique chemical synthesis method. By controlling the reactions, we have produced fine particle powders suitable for small all-solid-state batteries. For more details about other products, please contact us. 【Features】 ■ Suitable for small all-solid-state batteries ■ Fine particle powder *For more information, please refer to the PDF document or feel free to contact us.

• Other metal materials

"Serafit" is a negative thermal expansion material synthesized from zirconium tungsten phosphate [Zr2WO4(PO4)2] powder using a complex oxide synthesis technology. It exhibits a thermal expansion coefficient of "-3ppm/℃," indicating a negative slope. In device materials where high precision is required, incorporating negative thermal expansion materials into various substrates such as resins and ceramics to create composites can suppress thermal expansion and reduce dimensional changes in materials due to temperature. 【Features】 ■ Can be blended with various substrates, including resins and glass ■ Confirmed thermal expansion suppression effects based on blending amounts ■ Depending on the type of substrate, thermal expansion suppression effects exceeding the rule of mixtures can be expected *For more details, please refer to the PDF document or feel free to contact us.

• Composite Materials

"Parceram BT" is barium titanate (BaTiO3) synthesized using the oxalate method. It has been used as a material for capacitors for a long time, particularly as a dielectric material for multilayer ceramic capacitors (MLCC; Multi Layer Ceramics Capacitor). In addition to the fine particle type, we also offer a large particle type with a particle size of 2.0μm or more, so please feel free to contact us. 【Features】 ■ High dielectric constant ■ Stable composition ratio (Ba/Ti ratio) of barium titanate ■ Synthesis of high-purity products is possible ■ Uniform particle size can be obtained *For more details, please refer to the catalog or feel free to contact us.

• Organic Natural Materials