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Our company provides cutting (dicing) and grinding (thinning) processing technologies primarily for semiconductor silicon wafers. Additionally, this processing technology is extended to a wide range of materials that are considered difficult to process, such as optical glass, ceramics, and SiC sapphire. We cut IC chips smaller, thinner, and with greater precision. Furthermore, you can also rely on us for round processing, curves, and precision hole drilling. 【Features】 ■ Processing can be done using pure materials in a clean environment ■ Equipped with ultrasonic functions for precise processing of difficult-to-machine materials ■ Integrated processing within the same process *For more details, please download the PDF or contact us.

• Processing Contract

Suntech Co., Ltd. provides cutting (dicing) and grinding (thinning) processing technologies primarily for semiconductor silicon wafers. Additionally, these processing technologies are applied to various materials that are considered difficult to process, such as blue glass, ceramics, and solder sheets. We utilize technologies such as back grinding (grinding and polishing), dicing, chip tray technology, and visual inspection technology. Furthermore, Suntech's prototype technology support division offers clean rooms and processing equipment. For more details, please contact us or refer to our catalog.

• Other semiconductors
• Processing Contract
• Glass