石川技研工業 Product Lineup

Ishikawa Giken Kogyo Co., Ltd. pursues processing precision of ceramics and SiC (silicon carbide), while also focusing on integrated production including lapping processes, as well as processing of various types and one-off items, and prototype processing to enhance customer convenience. As an example of Ishikawa Giken Kogyo's processing technology information, we would like to introduce "grinding processing of ferrite." 【Processing Technology Information】 - Grinding processing of ferrite - Samples for evaluation are machined from block material - Hole processing, groove cutting, and shape processing are also possible For more details, please contact us or download the catalog.

• Ceramics
• Processing Contract
• Contract manufacturing

Ishikawa Giken Kogyo Co., Ltd. pursues processing precision of ceramics and SiC (silicon carbide), while also striving for customer convenience through integrated production including lapping processes, as well as processing of various types and one-off items, and prototype processing. As an example of Ishikawa Giken Kogyo's processing technology information, we would like to introduce "High Precision Processing of Ceramic Rollers." 【Processing Technology Information】 ○ High Precision Processing of Ceramic Rollers ○ Processing Precision: Outer Diameter Tolerance 5μ, Surface Roughness Ra0.06, Cylindricity 3μ ○ Processing Precision: Minimum Hole Diameter φ1.0, Hole Diameter Dimensional Tolerance ±2μ For more details, please contact us or download the catalog.

• Ceramics
• Processing Contract
• Contract manufacturing

Ishikawa Giken Kogyo Co., Ltd. pursues processing precision for ceramics and SiC (silicon carbide), while also focusing on integrated production including lapping processes, as well as processing of various types and one-off items, to enhance customer convenience. We would like to introduce an example of our processing technology information: "Thin Material Machining." 【Processing Technology Information】 - Thin ceramic processing - Production of components with a thickness of 200μ - Materials: Alumina, ALN, SiC, Zirconia, Sapphire For more details, please contact us or download the catalog.

• Ceramics
• Processing Contract
• Contract manufacturing

Ishikawa Giken Kogyo Co., Ltd. pursues convenience from the perspective of "VE proposal examples" that solve customer problems through "short delivery times," "integrated production," "customized responses," "variety production," and "prototyping to mass production." We are well-known for our grinding processing of ceramics and SiC, particularly for high-precision processing with dimensional accuracy of ±3μm to 1μm, primarily supplying semiconductor components. Our processing methods mainly focus on the machining of ceramics and cemented carbide, and we manufacture precision parts by combining cutting and grinding processes. Additionally, we handle post-processing surface treatments in collaboration with specialized contractors we work with (such as mirror finishing, coating, and blasting). For more details, please contact us or refer to our catalog.

• Ceramics
• Processing Contract
• Contract manufacturing