株式会社モック List of Products and Services

We would like to introduce the advantages of the mini runner that we handle. Since the amount of resin required for the runner can be reduced, thermal energy can also be minimized. Additionally, the cooling time is shortened, leading to a reduction in cycle time. 【Cost Reduction Effects】 ■ Easy integration into molds ■ Simple mold design and easy maintenance ■ Temperature controller can be managed with a single circuit, ensuring a temperature difference of 4°C between nozzles ■ Compatible with all injection molding materials, making color changes (material changes) easy ■ Suitable for small precision parts *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The mini runner device consists of a "manifold" that incorporates a heater, sprue bush, and extension nozzle. Therefore, it can accommodate any mold design. The extension nozzle allows for smooth resin flow by connecting to the sprue of the mold. It can be used for both new molds and modifications of existing molds. 【Features】 ■ Composed of a manifold ■ Compatible with any mold design ■ The extension nozzle ensures smooth resin flow when connected to the mold's sprue ■ Usable for modifications of new and existing molds *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

Here is an introduction to our "Heater-equipped Long Extension Nozzle." This product features a heater attached to the extension nozzle. It is equipped with a contact bush and has a valve-less mechanism. There are two types, Type A and Type B, depending on the length of the heater, and the manifold specifications are the same as standard. 【Type A Specifications】 (L dimensions: tolerances) ■40mm: -0.02/-0.04 ■45mm: -0.02/-0.04 ■50mm: -0.02/-0.04 *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• nozzle

We would like to introduce our "Extension Nozzle." This product features a unique structure that prevents drooling and resin leakage. Due to the design of the mini runner, it minimizes pressure loss and supplies resin to each extension nozzle without obstructing the flow. We offer three types, composed of four parts. 【Lineup】 ■ Type A: φ25mm Standard Type ■ Type C: φ16mm Standard Type ■ Type D: φ18mm Standard Type *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements
• nozzle

Our "Extended Nozzle Single Row Mini Runner Device" consists of a manifold that incorporates a spool bush, heater, and extended nozzle. The nozzle does not have a heater, and the nozzle temperature can be controlled by the heater in the manifold, making it compatible with any mold design. 【Specifications (excerpt)】 ■ Width of manifold: 60 ■ Thickness of manifold: 40 ■ Diameter of resin hole in spool bush: φ 6 ■ Nozzle touch: standard R10.5 (custom only) ■ Diameter of resin hole in gate chip: standard φ2 (custom only) ■ Contact surface: standard φ6 (custom only) *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "Extended Nozzle Two-Row Mini Runner Device" features a structure that integrates a heater, spool bush, and extended nozzle into a manifold. It can accommodate any mold design. Depending on the mold design, we can provide the necessary locations and the required number of nozzles. 【Specifications (Excerpt)】 ■ Thickness of manifold: 55 ■ Diameter of resin hole in spool bush: φ 6 ■ Nozzle touch: Standard R10.5 (custom only) ■ Diameter of resin hole in gate chip: Standard φ2 (custom only) ■ Contact surface: Standard φ6 (custom only) *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The mini runner device's manifold body uses a dedicated cartridge heater. Additionally, the nozzle is heated by thermal conduction from the manifold body. As a result, it achieves a better temperature balance than a fully hot runner that requires temperature control, and it can also reduce annual power consumption. 【Mini Runner Device Features】 ■ Manifold Body - Usable with temperature control for a single circuit - Thickness I type = 40 mm H type = 55 mm ■ Nozzle - Specification without a heater thermocouple on the extended nozzle - Heated by thermal conduction from the manifold body ■ Ease of design: Pitch between nozzles can be designed to be narrow *For more details, please refer to the PDF materials or feel free to contact us.

• Other machine elements

Here is a case study of the introduction of mini runners. We modified the pin gate mold and significantly reduced the runner weight. The fluidity improved, allowing us to make the runners thinner and smaller. We successfully reduced the runner volume by approximately 71.6%. Additionally, we were able to reduce the runner weight by about 10.29 grams. 【Case Overview】 <Before Introducing Mini Runners> ■ Runner Volume: 2831.11 x 4 = 11324.44mm³ ■ Runner Weight: 14.38 grams <After Introducing Mini Runners> ■ Runner Volume: 804.2835 x 4 = 3217.13mm³ ■ Runner Weight: 4.09 grams *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

Here is a case study on the introduction of mini runners. We modified the submarine gate mold, significantly reducing the runner weight. The large runners have been made smaller, greatly improving workability. We successfully reduced the runner volume by approximately 74.7%. Additionally, we were able to reduce the runner weight by about 23.11 grams. 【Case Overview】 <Before Mini Runner Introduction> ■ Runner Volume: 317,377.79 mm³ ■ Runner Weight: 30.93 grams <After Mini Runner Introduction> ■ Runner Volume: 549.23 x 8 = 4,393.84 mm³ ■ Runner Weight: 7.82 grams *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

We would like to introduce a case study of the mini runner implementation. We modified the submarine gate mold to significantly reduce the runner weight. The H-type 8-point nozzle is achieved with a narrow nozzle pitch. We successfully reduced the runner weight by approximately 5.3g, achieving a reduction rate of 68%. Additionally, the cycle time was reduced by about 10-15%. 【Case Overview】 <Before Mini Runner Implementation> ■ Runner Weight: 7.8g ■ Cycle Time: 20 seconds <After Mini Runner Implementation> ■ Runner Weight: 2.5g ■ Cycle Time: Approximately 17 seconds *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

The "Mini Runner Device" has over 30 years of proven performance since its launch, minimizing raw material loss costs and contributing to shorter molding cycles and quality improvement. We accurately inherit the technology and know-how of the Mini Runner manufactured by Myojo Metal Industry Co., Ltd., and we produce it domestically. As a result, we can provide maintenance and repair parts from two locations, allowing for a quicker response. 【Features】 ■ Over 30 years of proven performance since launch ■ Contributes to shorter molding cycles and quality improvement ■ Accurately inherits the technology and know-how of the Mini Runner from Myojo Metal Industry Co., Ltd. ■ Reliable domestic production ■ Quick response for maintenance and repair parts supply *For more details, please refer to the external link page or feel free to contact us.

• Other machine elements
• Other electronic parts

MSK's "Mini Runner System" is a device that reduces runner volume by 50-80% in injection molding, thereby decreasing thermal energy, cooling time, and cycle time. 【Features】 ◆ Reduction of raw material costs and runner volume ◆ Reduction of cooling time ◆ Easy integration into molds ◆ Stable temperature control 【Compatible Resins】 ◎ Applicable to all injection molding resins, including engineering resins, high-temperature resin materials, rubber molding, and high-temperature resins exceeding 400°C such as MIM, LCP, and PPS! 【For more details, please download the catalog or feel free to contact us】

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• Other electronic parts

The mini runner system is a device that reduces the amount of runners in injection molding by 50-80%, thereby decreasing thermal energy, cooling time, and cycle time. It has a proven track record of over 30 years since its launch. Unlike existing hot runner systems, it generates small runners while achieving precise control of heating and cooling. It can be applied to all injection molding resins, including engineering resins, high-temperature resin materials, rubber molding, and MIM. It also demonstrates high effectiveness with high-temperature resins such as LCP and PPS, exceeding 400°C. 【Features】 ■ Reduction of raw material costs and resin used for runners ■ Reduction of cooling time ■ Easy integration into molds ■ Compatible with all injection molding materials ■ Stable temperature control For more details, please contact us or download the catalog.

• Other machine elements
• Other electronic parts

MSK's "Hot Spool Bush" eliminates the spool section of the runner by replacing the mold's spool bush. The spool section of the runner not only leads to material loss but also obstructs resin flow, requiring excessive injection pressure and causing issues such as stress that degrade molding quality. By installing the "Hot Spool Bush," the spool of the runner is eliminated, avoiding these problems. Additionally, the bulk of the runner is reduced by half, allowing for a decrease in transportation effort, storage space, and production costs. 【Features】 ■ Reduction in raw material costs ■ Reduction in resin required for the spool ■ Complete prevention of stringing ■ Reduction in cooling time ■ Several times more durable compared to standard heaters For more details, please contact us or download the catalog.

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