エムワン精工 List of Products and Services

M1 Seiko provides high-level domestic "precision centerless grinding processing." Typically, in the field of centerless grinding, high precision often refers to a diameter tolerance of about 2/1,000 mm. Our company can achieve roundness of 3/10,000 mm at mass production levels. Additionally, we can handle medical devices and various gauges where precision cannot be compromised, as well as rare metals, which are often difficult to process in most factories. 【Features】 ■ Provides high-level domestic precision centerless grinding processing ■ Achieves roundness of 3/10,000 mm at mass production levels ■ Capable of handling medical devices, various gauges, and rare metals *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Wafer processing/polishing equipment

M1 Seiko is a leading domestic company with technology that can stably supply "taper-matched processed products" with a hit rate of over 90%. Typically, even for high-precision class standard taper gauges, the hit rate is considered to be over 80%, but our company provides products with such extremely high precision at the "component" level, rather than just at the standard gauge level. Achieving a hit rate of over 90% is more challenging than producing micron-level dimensions in general component processing and requires accuracy comparable to sub-micron level dimensioning. 【Features】 ■ Hit rate of over 90% ■ Leading domestic technology ■ Provides products with extremely high precision *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Special Processing Machinery

At M1 Seiko, we specialize in extremely high-precision "special screw grinding processing," rather than the so-called general-purpose screws for industrial use. Our products are utilized in various fields such as automobiles, machine tools, semiconductor manufacturing equipment, aircraft, and academic research, and we have received high praise, particularly for extremely high-precision prototypes and samples that are required in the pre-mass production stage. In recent years, they have also been used in precision positioning devices such as actuators. *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract
• Wafer processing/polishing equipment

At M1 Seiko, we have extensive experience and know-how in "cylindrical grinding," providing processing at the micron level. In response to customer demands for higher precision products, we also perform work to increase the hardness of the center hole through heat treatment, followed by lapping with a conical lap bar after grinding. By following such processes, the center hole, which serves as the standard for the product, can maintain high precision, allowing for finishing using a stable reference center hole even during subsequent additional processing or dimensional changes. 【Commitment to Shaft Precision】 - When processing high-precision shafts such as spindles and precision shafts, we always use dedicated grinding machines for center hole grinding. - By grinding the hardened center hole, we prevent sagging during cylindrical grinding and reduce wear resistance with dedicated molybdenum grease, improving roundness and cylindrical accuracy. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Wafer processing/polishing equipment

At M1 Seiko, we have accumulated extensive know-how over the years, and we select the most suitable processing methods while considering the stresses on our products to provide high-precision "inner diameter grinding." We offer a wide range of chucking fixtures that can be used in various applications, and we are constantly developing methods to securely fix products without applying unnecessary force. Additionally, our CNC inner diameter grinding machines are currently equipped with high-frequency spindles that boast a high level of precision. 【Equipment】 - We always have five spindles available for general inner diameter grinding machines. - Each spindle is regularly assessed based on usage time, unusual noises during rotation, and variations in precision, and we perform timely overhauls to maintain accuracy. - Our CNC inner diameter grinding machines utilize high-frequency spindles that achieve a high level of precision. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Wafer processing/polishing equipment

M1 Seiko Co., Ltd. is located in Ota Ward, Tokyo (Kamata area), where some of the best craftsmen in the country compete fiercely, and specializes in high-precision products in the micron to sub-micron range. Our processing fields are broad, including polishing, turning, milling, jig grinding, gear grinding, molding grinding, centerless (dead tools), NC turning, machining, wire cutting, and electrical discharge machining, allowing us to handle everything from parts to equipment, metals to resins, small items to medium-sized items, and from custom-made single pieces to mass production. We also focus on providing ideas and know-how, including design and development, and have a proven track record of solving problems for difficult jobs that other companies have declined or for products that did not meet the required precision or performance. Among the processing fields mentioned above, several of our main products have received high praise from discerning customers who have stated for many years that "there are no alternative suppliers." 【Business Activities】 ○ Precision parts processing (metal/resin) ○ High-precision measurement jigs/gauge manufacturing ○ Special industrial equipment manufacturing ○ Various design and development For more details, please contact us or download the catalog.

• Processing Contract
• Special Processing Machinery
• Other measurement, recording and measuring instruments