Electronic Components and Semiconductors

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三和電子サーキット

addressOsaka/Higashisumiyoshi-ku, Osaka-shi/3-28-1 Sōzu

phone06-4301-1531

Official site

last updated：Dec 03, 2024

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三和電子サーキット List of Catalogs

1～18 item / All 18 items

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SEC special printed circuit board materials

Product catalog

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Introduction to SEC Special Substrates

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Introduction of SEC special substrates

Product catalog

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End face electrode (end face through hole, burr prevention, soldering measures)

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Printed Circuit Board Manufacturing Process

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Overview of Double-Sided Printed Circuit Board Process

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Heat-dissipating substrate variation

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CAD design and prototype implementation

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Substrate Variations <Flexible Substrates / Thin Plate Bending Substrates>

Product catalog

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Substrate Variations <Functional Step Substrate / Ultra-Thin Rigid Substrate>

Product catalog

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Board Variations <Tent Through-Hole Board, Resist Hole Filling Board, Silicone Printed Board, Silicone Embedded Board>

Product catalog

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End face electrode substrate <End face through-hole substrate, narrow pitch end face through-hole substrate, partial etching through-hole substrate>

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Substrate Variations <Bonded Substrate・Side Coated Substrate>

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High-frequency hybrid substrate "Hybrid substrate - fluororesin substrate"

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High-speed signals and high-density substrates: Back drill substrates, IVH substrates, build-up substrates.

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High heat dissipation substrate "Metal base substrate / Bending aluminum base substrate"

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High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin] - Thick Copper Substrate"

Product catalog

Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>

Company documents

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