Electronic Components and Semiconductors

マイクロプロセス

number of employees5
addressTokyo/Chuo-ku/1-21-7 Kakigaracho, Nihonbashi, 3rd Floor, Nihonbashi YT Building
phone03-5623-3663
last updated：
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Substrate 3μm thickness positive type DFR Positive DFR110

This is a positive-type DFR with a film thickness of 3μ that can be used on existing manufacturing lines for sub-trays.

Positive DFR 110 is a positive-type DFR with a 3μ film thickness that can be used on existing manufacturing lines for sub-trays. The main components are patented. It can be used with roll laminators as it does not produce voids or wrinkles during lamination. The etching solution diffuses in a 5μ space (narrow gap), improving etching resolution. No roughening treatment is required, and it is compatible with high frequencies. It has excellent adhesion. 【Features】 ○ No voids or wrinkles during lamination ○ Etching solution diffuses in a 5μ space (narrow gap) ○ Excellent adhesion ○ 1% sodium carbonate development / zero scum generation ○ Zero resist fragment generation during peeling For more details, please contact us or download the catalog.

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