日本ミルテック List of Products and Services

The inline 3D AOI device "ART SERIES" for substrate mounting has achieved complete 3D inspection of solder joints. With conventional moiré methods, it is not possible to accurately measure the height of solder fillet areas, making it impossible to conduct the solder wetting inspection recommended by IPC standards. The "ART SERIES" can measure component height based on the phase shift of light, allowing for measurements compliant with IPC standards. 【Features】 ■ Complete 3D image acquisition using a top camera and side camera (patent pending) ■ Equipped with five high-resolution 15M pixel cameras ■ OCR inspection of component markings using AI technology ■ 8-stage color lighting: improved defect detection capability ■ Z-axis assist function (camera unit + 36mm movement) *For more details, please contact us or download the catalog.

• Circuit Board Inspection Equipment
• Visual Inspection Equipment

We would like to introduce our dual-sided inspection solution for printed circuit board assembly, the 'DSI Series.' By utilizing a dual-lane device, we solve the challenges of typical dual-sided inspection lines while significantly improving work efficiency. Additionally, by using the dual-lane model inspection device, the transport time of the boards can be eliminated, allowing for the inspection equivalent to two single-sided inspection devices. 【Features】 ■ Capable of inspecting the equivalent of two single-sided inspection devices ■ Line length is approximately 3.5m ■ Leads to a reduction in work time (transport time) ■ No need for empty magazine storage near the board supply and storage device ■ Contributes to increased productivity per unit area in the factory *For more details, please refer to the PDF document or feel free to contact us.

• Circuit Board Inspection Equipment

The "MV-3L" is a 2D tabletop AOI device equipped with Laser and Side cameras, enhancing defect detection capabilities. With a 10 MegaPixel camera, it can capture and inspect a wider area all at once compared to devices equipped with a 4 MegaPixel camera, achieving high-speed inspection. Additionally, it features complete coaxial illumination, allowing it to perform polarity inspection, character inspection, component matching, and 2D inspection of solder fillets without being affected by adjacent components such as electrolytic capacitors. 【Features】 ■ Equipped with a 10 MegaPixel TOP camera ■ 8-stage color lighting: perfect for solder inspection ■ Intelli-Beam Laser float inspection ■ Equipped with a 10 MegaPixel Side camera ■ Use of telecentric lenses *For more details, please refer to the PDF document or feel free to contact us.

• Circuit Board Inspection Equipment

The "MV-3OMNI series" is a suitable AOI device for inspecting SMT components to discrete components. It projects moiré stripe light onto the mounted components and measures the height of the components based on the phase shift of the reflected light. This allows for the inspection of component lift, missing parts, and other issues based on differences in component height. Additionally, it illuminates the circuit board with five colors (white, red, yellow, green, blue) at eight different angles, enhancing the visibility of defects and improving defect detection capability. 【Features】 - Equipped with solder inspection algorithms for discrete components - Maximum inspectable board size: 660mm x 510mm - Eight-stage color lighting: improved defect detection capability - OCR inspection of component markings using AI technology - Z-axis assist function (camera unit + 36mm movement) - Equipped with an 18 Mega Pixel or 10 Mega Pixel oblique camera *For more details, please refer to the PDF document or feel free to contact us.

• Circuit Board Inspection Equipment

The 3D AOI device for substrate assembly, "MV-6 EM OMNI," is a 3D AOI device that achieves a reduction in excessive detection. It projects moiré fringe light onto the mounted components and captures the reflected light with a camera. The height of the components can be measured from the phase shift of that light (reflective phase shift moiré method). Utilizing this principle, it measures the height of components and IC leads. Inspections for component lifting, IC lead lifting, and missing parts are conducted based on the differences in height. Compared to conventional 2D inspections, defect detection has significantly improved, thereby reducing the excessive detection issues that were challenges in 2D inspections. 【Features】 ○ OMNI-VISION(R) 2D/3D Inspection Technology ○ Avoidance of moiré fringe scattering effects ○ 8-stage color lighting ○ 10 Mega Pixel Side-Viewer(R) System For more details, please contact us or download the catalog.

• Circuit Board Inspection Equipment
• Visual Inspection Equipment

This is the "Comprehensive Catalog of Board Appearance Inspection Equipment" from Nihon Miltec Co., Ltd., which is engaged in the sales and maintenance of image inspection devices and their peripheral equipment for the SMT industry. It features various appearance inspection devices for the SMT assembly industry and semiconductor industry, including the "3D AOI Device MV-9" for complete inspection of next-generation fine chip components 03015. 【Featured Products】 ○ 3D AOI Device for Board Assembly MV-9/MV-7 OMNI ○ 2D Desktop AOI Device for Board Assembly MV-3L ○ 2D + Laser Measurement AOI Device for Board Assembly MV-6E/MV-7xi ○ 3D Cream Solder Printing Inspection Device MS-15/11, and more For more details, please contact us or download the catalog.

• Circuit Board Inspection Equipment
• Visual Inspection Equipment