大分デバイステクノロジー Product Lineup

We can support production from prototype to mass production of TO packages. They are widely used for the characteristic/function evaluation of power device semiconductors currently under development by our customers. Please feel free to consult with us.

• Other semiconductors
• EMS

In conventional power module general-purpose packages, they were unsuitable for use with high-performance devices such as SiC, GaN, and Ga2O3. The next-generation power module general-purpose package FLAP developed by our company solves these issues and significantly improves indicators such as volume, thermal resistance, and package inductance compared to conventional products.

• Other semiconductors
• EMS

The 6 in 1 650V/400A power module developed by our company can be used in high-reliability applications such as electric vehicles. - Motor drive - Industrial inverter Designed to withstand temperatures up to 150°C, compatible with three-phase inverters, and features trench field stop. Equipped with IGBT and freewheeling diode (IGBT and diode are manufactured by MinebeaMitsumi). Cooling is supported by a water cooling system, with low thermal resistance allowing for high heat dissipation of IGBT at 0.1°C/W.

• Other semiconductors
• EMS

We offer reliability testing of power semiconductor modules and power cycle testing. Our company has developed an "electric current testing control unit" in-house, enabling us to conduct relatively inexpensive power cycle testing by controlling a general-purpose power supply with our own developed control unit. If you want to conduct power cycle testing at a low cost and have a limited budget for testing, please feel free to consult with us.

• Other semiconductors
• Contract Analysis