六甲電子 List of Products and Services

Our company offers a "Wafer Support Service" for ultra-thinning, specializing in integrated processing of polishing, grinding, cleaning, and MEMS processing. Thinned wafers can be delivered in a supported state for integration into the customer's process. Additionally, wafers will be shipped attached to dicing tape. 【Heat & Chemical Resistance】 ■ Heat Resistance: 220℃ for 2 hours, 3 times ■ Chemical Resistance - Acid: Hydrochloric acid for 3 hours - Alkali: 2.38% for 3 hours *For more details, please download the PDF or contact us.

• Wafer processing/polishing equipment

Rokko Electric Co., Ltd.'s contract processing can consistently perform grinding → polishing → RCA cleaning of SiC wafers using a unique method. We achieve grinding → polishing → RCA cleaning with existing silicon processing machines. Compared to current dedicated machines, we can offer high speed, low warpage, high surface roughness, and large diameter compatibility, all through integrated processing. The grinding and polishing technology of silicon wafers, which affects the characteristics and performance of semiconductors, is developed, improved, and updated with high precision. 【Features】 ○ Reduced processing time and costs with grind grinding ○ High-speed and ultra-smooth CMP ○ High quality achieved through RCA cleaning ○ Epi regeneration processing For more details, please contact us or download the catalog.

• Processing Contract