Electronic Components and Semiconductors
伸光製作所

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Our company’s development of "MSAP" was featured in the Nikkei Sangyo Shimbun. "MSAP" is a technology that forms wiring through plating on ultra-thin copper foil. It is a method advantageous for fine wiring of circuits, enabling the miniaturization of products. Shinko Manufacturing Co., Ltd. will provide high-density and high-reliability printed circuit boards that are environmentally friendly using this technology. *For more details, please refer to the related products and catalog, or feel free to contact us.
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