日機装 List of Products and Services

The warm water laminator is a device that applies pressure uniformly in three dimensions using warm water as the pressure medium. By adopting a warm water circulation system, it allows for thermal bonding at a uniform temperature, which helps to equalize the density of the green sheet and contributes to the stabilization of dimensions after firing. Furthermore, due to the large production capacity per batch, it achieves about three times the production volume of a mechanical press. Options for loading mechanisms can be installed, ranging from small to large sizes. Additionally, we have developed the warm water laminator S-Series, which is a full model change of the existing equipment, pursuing space-saving, energy-saving, and labor-saving features. This will contribute to further improvements in productivity and quality. 【Features】 ■ Uniform pressure application from all directions (isotropic pressure) up to 400 MPa ■ Uniform heating (water medium: MAX 90°C, oil medium: MAX 120°C) ■ High productivity We have a demo machine available. Please feel free to contact us. Contact: Precision Equipment Tokyo Sales Division 1, Mori Phone number: 03-3443-3780

• Secondary Cells/Batteries
• Forging Machine
• Capacitor

Cold Isostatic Pressing (CIP) is a device that applies pressure uniformly in three dimensions using liquid as the pressure medium. There is no pressure variation even on uneven workpieces. 【Applications】 - Molding of powders such as ceramics and metals - Increasing the density of molded products Regardless of the precision of the press machine components, it allows for easy and safe uniform pressure application on the workpiece. We have demo machines available. Please feel free to contact us. Contact: Mori, Precision Instruments Tokyo Sales Division 1 Phone number: 03-3443-3780

• Powder Molding Machine
• Secondary Cells/Batteries
• Fine Ceramics

The "Next Generation Hi-Stacker-N Series" is an automatic stacking device that stacks various types of workpieces with high precision of ±10μm/layer. It achieves zero defective products in adhesive sheet stacking, which is difficult with sheet formats, without using air tack. Additionally, since no external force is used for temporary fixing, high-precision stacking without deformation is possible. With five distinct stacking methods and their combinations, we can propose the optimal stacking method suited to your application. 【Features】 ■ Zero air tack (Type 5) ■ Zero misalignment after stacking (Type 4) ■ Low-load film peeling (Type 2 or 3) We have demo units available. Please feel free to contact us. Contact: Precision Instruments Tokyo Sales Division 1, Mori Phone number: 03-3443-3780

• Substrate transport device (loader/unloader)
• Assembly Machine
• Other processing machines

By adopting a special elastic body in the press head section, it has become possible to generate uniform pressure that cannot be achieved with conventional mold mechanical presses. Multi-chips can be uniformly vacuum-pressed simultaneously. 【Features】 ■ Uniform Pressure → By using a special elastic body in the press head section, uniform pressure that cannot be achieved with conventional mold mechanical presses is possible! ■ High-Temperature Pressing → High-temperature pressing up to 300°C is also possible! ■ High-Speed Vacuum → The time to reach a vacuum level of 10 Torr is just a few seconds! Contributes to reduced voids! 【Applications】 - Simultaneous bonding of multiple ICs (multi-chips) such as flip chips - Voids-free lamination of sealing resin sheets - Bonding and molding of ceramic substrates with cavities Demo units are available. Please feel free to contact us. Contact: Precision Equipment Tokyo Sales Division 1, Mori Phone number: 03-3443-3780

• Other processing machines
• Press Dies
• Forging Machine