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Our company will be exhibiting at SEMICON JAPAN 2023. Please see the details below. We look forward to your visit. 【Exhibition Overview】 - Exhibition Name: SEMICON JAPAN 2022 - Date: December 14 (Wednesday) to December 16 (Friday), 2022, 10:00 AM to 5:00 PM - Venue: Tokyo Big Sight, 3-10-1 Ariake, Koto-ku, Tokyo - Booth: East Hall 1, Booth Number 1704 【Exhibited Products】 - ASMPT: Manufacturer of back-end equipment such as die bonders, ovens, wire bonding, and molding. - SUSS Microtech: Manufacturer of exposure equipment such as mask aligners. - Nova Ancosys: Manufacturer of automatic plating solution analysis equipment for semiconductor manufacturing processes. - Micro Point Pro: Manufacturer of high-precision equipment such as manual wire bonders, wedge tools, die collets, and 4-point probes. - NS Technologies: IC test handlers. - INNOLAS: Wafer sorters and wafer markers. - Arnea Laboratory: Non-contact wafer measurement equipment. Please feel free to visit our booth.