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  3. AXIS TECHNOLOGY
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AXIS TECHNOLOGY

EstablishmentDecember 2010
addressTokyo/Hachioji-shi/22-5 Takakuramachi
phone042-649-2392
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last updated:Jan 06, 2020
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AXIS TECHNOLOGY List of Products and Services

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Inspection device "AXIS7000"

Introducing customizable chip bonding and wire bonding inspection equipment.

The "AXIS7000" is a testing device for chip bonding and wire bonding that can effectively divide various inspection items into two testing stages. It allows for automatic supply and discharge via a loader and unloader, and can be connected with a robot. It also supports the processing of defective workpieces (laser marking and mold cutting). Image data and inspection result data can be stored and managed within the device, and communication with a higher-level server is possible. 【Features】 ■ 2D and 2.5D high-precision inspection stages ■ Automatic frame width exchange ■ 2.5D rotating stage ■ Compatible with various processes ■ Inspection data management and MAP data support *For more details, please refer to the PDF materials or feel free to contact us.

  • Other inspection equipment and devices

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Picker Handler "KIG-3000"

Rich variety of inspection items! Achieved high speed and stability with a unique vertical rotary head system.

The "KIG-3000" is a high-speed picker handler capable of a maximum processing capacity of 0.35 seconds per unit. It can pick up devices from diced wafers (with flip marks), and after flipping, it can store them in trays or apply tape. Thanks to its unique vertical rotary head design, it achieves both high speed and stability. 【Features】 ■ High-speed capability with a maximum processing capacity of 0.35 seconds per unit ■ High speed and stability achieved with a unique vertical rotary head design ■ Extensive inspection items ■ Damage-free transport ■ Auto-recovery function *For more details, please refer to the PDF document or feel free to contact us.

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Simple Type Appearance Inspection Device 'ACT-α1'

Supports challenging work such as narrow pitch implementation connectors, card connectors, and ultra-small chip components.

The "ACT-α1" is a simplified appearance inspection device that enables testing in actual usage conditions. It inspects the coplanarity and pitch of objects such as connectors placed on the inspection stage through image processing from four directions. By registering any position with the camera slider, it allows for continuous inspection of multiple positions. It can also accommodate automatic supply and embossed discharge by connecting with the transport unit. 【Features】 - A high-precision and high-speed inspection system that enables testing in actual usage conditions - Capable of handling difficult work such as narrow-pitch mounted connectors, card connectors, and ultra-small chip components - Allows for continuous inspection of multiple positions by registering any position with the camera slider - Can accommodate automatic supply and embossed discharge by connecting with the transport unit - Capable of inspecting coplanarity in a "self-weight state" *For more details, please refer to the PDF materials or feel free to contact us.

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3D Inspection Unit 'ACT.-3D-W1'

Achieve simple and fast 3D coplanarity inspection of BGA/QFN/QFP!

The 『ACT.-3D-W1』 is a 3D inspection unit that is half the size of conventional models. Using a high-resolution camera and high-precision telecentric lens, it achieves high-accuracy 3D inspection through a unique algorithm. Its integrated structure eliminates camera position misalignment and improves compatibility for incorporation into devices. The double calibration method resolves distortions in both 2D and 3D. 【Features】 ■ Uses a high-resolution camera and high-precision telecentric lens ■ Achieves high-accuracy 3D inspection through a unique algorithm ■ Realizes half the size (width) compared to conventional models ■ Integrated structure eliminates camera position misalignment and improves compatibility for incorporation into devices ■ Double calibration method resolves distortions in both 2D and 3D *For more details, please refer to the PDF document or feel free to contact us.

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Embossed Tape Internal and External Inspection Device 'KIG-2000'

Appearance inspection of finished products sealed with cover tape is possible!

The "KIG-2000" is an appearance inspection device that automates the inspection of electronic components housed within embossed tape, significantly reducing costs associated with visual inspections. It inspects according to set conditions without missing any range, identifies defective candidates through machinery, and makes determinations using human judgment. Additionally, it achieves a high processing capability of 1,800 PCS/min (maximum processing capacity). Its structure provides tension to the tape, reducing surface reflection of the cover tape and ensuring inspection accuracy. 【Features】 ■ Captured with special optical equipment ■ Switches from visual inspection to automated inspection for more accurate results ■ Significantly improves inspection accuracy by momentarily stopping during inspection ■ Functions for storing, replaying, and re-inspecting defective images *For more details, please download the PDF or feel free to contact us.

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