丸源鐵工所 Product Lineup

The MVS-602B is a vibration sander equipped with an oscillating mechanism that allows for one-touch exchange of abrasives. The addition of the oscillating mechanism improves the level of surface roughness and smoothness, as well as the lifespan of the abrasive. Furthermore, by making contact with a relatively large area of the workpiece, it enables uniform and gentle surface contact. 【Features】 - Equipped with oscillating and jumping mechanisms - Ideal deburring polishing to prevent defects in printed circuit board production - Rotation diameter of circular motion increased from 3mm to 5mm - One-touch abrasive exchange - Easy maintenance *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "MDS-604FB (Reinforced Shaft Type)" is a precision surface grinding machine suitable for ink removal. The main frame is made with thicker steel plates compared to conventional grinders, enhancing rigidity. Additionally, a standard shaft type "MDS-604FBR" is also available. 【Features】 ■ Reinforced frame ■ Increased shaft diameter from φ40mm to φ45mm ■ Enhanced spindle bearings ■ Upgraded spindle motor from 2.2kw to 3.7kw ■ Improved maintainability *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "MDS-704S" is a precision surface leveling machine that significantly reduces the machine width, creating extra space on the auxiliary equipment side. The conveyor rollers achieve a narrow pitch roller through a combination of large-diameter and small-diameter rollers. Additionally, there is no substrate slip, allowing for easy transportation of thin substrates. 【Features】 ■ Significantly reduced machine width ■ Long apron section (650mm) for easy loading ■ Achieves narrow pitch rollers ■ Transparent cover for easy visibility of the machine interior and movement confirmation ■ All stainless steel for the water contact area and external panels *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "MNW-610･C2/MNW-710･C2" is a precision surface grinding machine capable of a consistent line configuration from heavy grinding to finishing. Due to its machine layout, it can be integrated to match the line equipment of your factory. It allows for repair grinding according to the unevenness and waviness of the substrate, making it suitable for leveling thickness variations after plating and for polishing build-up resin coatings. 【Features】 ■ Can be integrated to match the line equipment of the factory ■ Allows for repair grinding according to the unevenness and waviness of the substrate ■ Suitable for leveling thickness variations after plating and for polishing build-up resin coatings ■ Minimal wear of grinding materials, preventing adhesion of grinding debris to products and external scattering ■ Replacement of consumable parts can be done quickly by your engineers *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "MNW-710-SUS" is a multi-layer press stainless steel plate repair polishing machine capable of automatic reciprocating polishing. By simply setting the reciprocating function initially, all subsequent operations can be controlled automatically. This significantly improves the efficiency of repair work. Additionally, due to the wet polishing method, there is minimal wear on the polishing material, and there is no adhesion of polishing debris to the product or external scattering. 【Features】 ■ Capable of automatic reciprocating polishing ■ Significantly reduces working time ■ Equipped with a touch panel on the main unit, achieving space-saving ■ Allows for repair polishing according to the unevenness and height variations of the substrate ■ Minimal wear on polishing material, with no adhesion of polishing debris to the product or external scattering *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "MDS-604SSC" is a fully automatic 4-axis oscillating polishing machine for printed circuit boards that achieves high performance at a low price with a control panel. The base frame has been miniaturized, and thorough reinforcement through CAD design has efficiently improved overall strength. 【Features】 ■ Space-saving concentrated design ■ Re-evaluation of mechanical component parts to achieve low cost ■ Mechanical strength (vibration resistance) is improved by 150% compared to our conventional models ■ The spindle follows the proven conventional type, ensuring outstanding reliability ■ The spindle bearing uses large-diameter grease shield bearings, achieving maintenance-free operation and long lifespan *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment