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Bostik, a specialized adhesive company expanding into the global market (www.bostik.com), announces its latest innovations in engineering adhesives. This is part of the company's goal to create smart solutions for Industry 4.0 in Asia. In response to the demands of modern industry, the newly developed AU588 gasket solution replaces traditional gaskets and accommodates the automation of manufacturing processes. This is the latest product in Bostik's renowned Bostik Born2Bond portfolio, which features a wide range of high-durability UV-curable Cure-In-Place Gasket (CIPG) products. Bostik offers value propositions that align with industry trends, including high efficiency, automation processes, complex designs, miniaturization, lightweighting, waste reduction, and waterproofing/dustproofing. The AU588 can be applied to industrial electronic devices and factory automation components, such as advanced driver-assistance systems (ADAS) and electronic control units (ECUs). For more details, please visit the product page.

Polyurethane reaction-type hot melt (HMPUR) solutions have been a popular adhesive choice for decades, ranging from mass production to DIY home repairs. HMPUR products excel in strength, durability, and set time compared to existing products, allowing for development tailored to specific applications by leveraging each characteristic. Bostik, a global specialist in multi-market adhesives, provides expertise in HMPUR solutions. According to INVEST IN ASEAN (investasean.asaan.org), "Bostik is developing and deploying an innovative HMPUR product line under the Bostik Born2Bond brand, which is widely used in the electronics manufacturing sector, a key industry that accounts for up to 50% of total exports from Asian countries." Bostik's HMPUR solutions are part of the Bostik Born2Bond series, a groundbreaking portfolio of industrial adhesives focused on "by-the-dot" bonding applications. For more details, please visit https://www.bostik.com/.