Manufacturing and processing contract
立花デバイスコンポーネント
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Our company provides total support from the planning stage to development and mass production of modules and substrates equipped with semiconductors for applications such as wireless communication systems and camera systems. We also respond to needs for miniaturization and modularization with high-density mounting technology and system proposal capabilities. Please feel free to contact us first. 【Features】 ■ We serve as a single point of contact for a one-stop solution. ■ We select the best partners for design and production outsourcing to meet your requirements. ■ We have our own quality control department to ensure high quality through collaboration with partner companies. ■ We address needs for miniaturization and modularization with high-density mounting technology and system proposal capabilities. *For more details, please download the PDF or feel free to contact us.
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