- Publication year : 2021
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Sensor sealing is decided with this! We have published a catalog introducing Nakatani's new technology. By injecting low-melting-point thermoplastic resin into molds under low pressure and insert molding various electronic components, we can add diverse and excellent protective performance—this is a noteworthy new technology. That is our "Hot Melt Molding." The related catalog below introduces hot melt molding technology. Please download and take a look.
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