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The "TLSM-201" is a batch processing device equipped with CO2 laser oscillators with wavelengths of 10.6μm or 9.4μm. It enables high-quality film cutting with numerous features such as "low thermal impact," "crack-free," "variety of shapes," and "low running costs." Additionally, it can clean resin residues without damaging the mold. 【Features】 ■ Selects wavelength according to the material of the substance to be removed or the workpiece ■ Sets the cleaning area using CAD data ■ Designs and manufactures work handling mechanisms tailored to applications (supports automation and inline processing) ■ Prevents reattachment of removed materials through high air volume suction and air purging *For more details, please download the PDF or contact us.
