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  3. 武井電機工業 本社
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武井電機工業 本社

addressSaga/Miyaki-cho, Miyaki-gun/Eikuchi 2617
phone0942-89-4151
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last updated:Nov 28, 2018
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High-Power Fiber Laser Processing Unit 'TLFD-100'

Clean processing with minimal heat impact! Shortened processing time, and even deeper.

The "TLFD-100" is a laser processing unit that combines the ease of use and versatility of a laser marker with professional-grade performance. It compactly integrates a laser oscillator, digital galvanometer scanner, and control, allowing even beginners to use it with confidence for positioning reproducibility of less than 1μm, repetition frequencies of 50–1000kHz, and pulse widths of 20/30/60/120nsec. Additionally, it supports processing while conveying existing materials through synchronized control using an encoder. 【Features】 ■ Absolute processing capability with high output of 100W ■ Position reproducibility of less than 1μm using a digital encoder ■ Adjustable pulse widths of 20/30/60/120 nanoseconds according to processing needs ■ Processing while conveying workpieces through coordinated control with encoder signals *For more details, please download the PDF or feel free to contact us.

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Precision Hole Drilling Laser Processing Machine 'TLSM-401'

For precise hole drilling in film! Achieves a processing speed of 500 holes in 1.5 seconds with a taper of 5μm.

The TLSM-401 is a precision laser drilling machine equipped with a unique optical system that reduces thermal impact on the workpiece, achieving a balance between quality and speed. Laser drilling offers the advantage of stable quality due to its non-contact processing. Furthermore, because it is non-contact, it allows for drilling materials that are difficult to process with cutting tools, as well as position correction through image alignment. It is widely used in advanced precision processing, and the demand for precision drilling in the manufacturing of new products is expected to continue. 【Features】 - Capable of precision drilling with a taper of 5μm and a diameter of 0.2mm - Achieves high-speed processing of 500 holes in just 1.5 seconds - Reduces thermal impact on the workpiece through its unique optical system - Capable of processing various materials, including films *For more details, please download the PDF or feel free to contact us.

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Laser Cutting System for Optical Film 'TLSM-301'

Achieving a high level of both processing quality and capability! Complex shapes, corners, and curves can be processed at high speed and with high quality, just like straight lines.

The TLSM-301 is a laser cutting system for optical films that balances the processing capabilities required in mass production with the processing quality demanded for display optical films. By utilizing a high-speed scanning system with unique control technology, it significantly improves processing capabilities while achieving high processing quality with a newly developed optical system that reduces thermal effects. Additionally, non-contact processing using lasers allows for cutting without cracks, as no external stress is generated. 【Specifications (partial)】 ■Oscillator Rated Output (Wavelength): RF excited CO2 laser 400W (10.6μm) or 350W (9.4μm) ■Laser Scanning Method: On the fly using a galvanometer scanner and stage ■Galvanometer Scanner: Digital galvanometer scanner ■Stage: Linear drive XY stage (Max. 1000mm/s) ■Position Correction: Alignment via image recognition *For more details, please download the PDF or feel free to contact us.

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High-power CO2 laser processing machine 'TLSM-201'

Non-contact cutting, high-precision processing, low running costs! High-output laser with wavelengths of 10.6μm/9.4μm.

The "TLSM-201" is a batch processing device equipped with CO2 laser oscillators with wavelengths of 10.6μm or 9.4μm. It enables high-quality film cutting with numerous features such as "low thermal impact," "crack-free," "variety of shapes," and "low running costs." Additionally, it can clean resin residues without damaging the mold. 【Features】 ■ Selects wavelength according to the material of the substance to be removed or the workpiece ■ Sets the cleaning area using CAD data ■ Designs and manufactures work handling mechanisms tailored to applications (supports automation and inline processing) ■ Prevents reattachment of removed materials through high air volume suction and air purging *For more details, please download the PDF or contact us.

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