石井表記 List of Products and Services

Are you facing any of the following issues? ☑ I want to confirm the compatibility with inkjet equipment for our new product. ☑ I want to check the compatibility/performance with inkjet during material development. ☑ I want to consult from ink development to the introduction of inkjet equipment. Rest assured, we can assist you with all of these.

• Processing Contract

〈Launch of Full and Partial IJ Coating Models for Mass Production〉 【Features】 ■ Cost reduction of materials (liquid usage efficiency: up to 99%) ■ Wide coating support from full to partial coating. ■ Coating size: Max Φ100mm ■ Suitable for FPD, electronic components, and semiconductor packaging fields. ■ From IJ coating to drying, all in one machine. ■ Compatible with resist inks, conductive inks, and insulating inks. ■ Can support two-component systems. *For more details, please download the catalog or feel free to contact us.

• Processing Contract
• Ink/Toner
• Circuit board processing machine

〈Launch of High-Precision Coating Model for Mass Production〉 【Features】 ■ Cost reduction of materials (liquid usage efficiency: up to 99%) ■ Improved throughput through process reduction. ■ Wide coating support from high-precision patterning to partial coating. ■ Coating size: Max 300x300mm or Φ300mm ■ Suitable for FPD, electronic components, and semiconductor packaging fields. ■ From IJ coating to drying, all in one machine. ■ Compatible with resist inks, conductive inks, insulating inks, and particle-containing inks. ■ Two-component compatibility available. *For more details, please download the catalog or feel free to contact us.

• Processing Contract
• Ink/Toner
• Circuit board processing machine

Introducing Ishii's new product, a mass production inkjet device suitable for the electronic device field from liquid crystal to small inkjet evaluation devices. This is a comprehensive total solution model from coating to drying! We present the all-in-one inkjet IP300. It can reduce manufacturing costs due to ink usage efficiency (up to 99%) and is capable of full coating to partial coating on wafers, as well as accommodating stepped substrates. 【Features】 ◆ Reduction in manufacturing costs due to ink usage efficiency (up to 99%) ◆ Capable of full coating to partial coating ◆ Compatible with stepped substrates ◆ Suitable for thin films to thick films *For more details, please download the catalog or feel free to contact us.

• Processing Contract
• Ink/Toner
• Circuit board processing machine

■Selectable from two device models according to application ■Further expansion possible with multiple optional items ■Coating resolution: Max. 2400 dpi ■Coating area up to 300x300mm ■Coating speed up to 300mm/second ■Device size: 1200W x 1200D x 2025H mm ■Any device in the series can form thin films with a single pass coating, and with overlapping coatings, it can also accommodate thicker film formation ■Uniformity of the film is outstanding due to unique inkjet technology ■Significantly improved ink usage efficiency through a uniquely developed liquid delivery system and discharge control technology ■Wide range of compatibility including photosensitive resist ink, solder resist ink, UV ink, and SU-8 resist ink ■Automatic drawing of coating patterns from CAD data for ease of use ■Models available that can accurately target and coat recessed areas ■A wide lineup of devices from mass production inkjet coating machines to small inkjet coating devices for experimental and trial use, with support for demonstrations and coating tests Feel free to contact us for testing with actual machines.

• Processing Contract