イチカワテクノファブリクス 　 List of Products and Services

We would like to introduce the "industrial felt" handled by Ichikawa Techno Fabrics Co., Ltd. We offer a variety of high-performance products, including high heat-resistant felt (over 500°C). With the three main keywords of "cushioning," "transportation," and "protection/cover," our products are active in various manufacturing sites such as the printed circuit board industry, aluminum extrusion industry, and steelmaking industry. Please feel free to consult us when you need our services. 【Features】 ■ Cushioning material for high-temperature press molding and lamination ■ Compatible with high-speed communication standards (5G) ■ Low dielectric constant substrate ■ Film lamination ■ Attachment of dissimilar materials *For more details, please refer to the PDF document or feel free to contact us. Samples are also available.

• fiber
• Cushioning material

The "ACE BOARD Z Series" is a cushioning material for printed circuit board manufacturing that possesses both cushioning properties and thermal conductivity. It can be used at press temperatures of 300°C to 500°C or lower and is reusable. Additionally, the decomposition temperature of the constituent fiber (PBO) is 650°C. Please feel free to consult us when you need assistance. 【Features】 ■ Combines cushioning properties and thermal conductivity ■ Usable at press temperatures of 300°C to 500°C or lower ■ Reusable *For more details, please refer to the PDF document or feel free to contact us.

• fiber
• Cushioning material

The "ACE BOARD C Series" is a cushioning material for printed circuit board manufacturing that can be used at a press temperature of 200°C. It possesses both cushioning and thermal conductivity properties, making it reusable. You can select an appropriate cushioning material. Please feel free to consult us when needed. 【Features】 ■ Combines cushioning and thermal conductivity properties ■ Usable at a press temperature of 200°C ■ Reusable ■ Compatible with automatic transport through adhesion *For more details, please refer to the PDF document or feel free to contact us.

• fiber
• Cushioning material

The "ACE BOARD X・CX Series" is a cushioning material for printed circuit board manufacturing that combines cushioning properties with thermal conductivity. It is compatible with automatic transport through suction and can be used at press temperatures of 200°C to 300°C. Additionally, it can be reused multiple times. You can select suitable cushioning materials, so please feel free to consult us when needed. 【Features】 ■ Combines cushioning properties with thermal conductivity ■ Usable at press temperatures of 200°C to 300°C ■ Reusable ■ Compatible with automatic transport through suction *For more details, please refer to the PDF document or feel free to contact us.

• fiber
• Cushioning material

"Felt for Steel Plates" is a product designed to prevent damage when heated steel plates, which are still at temperatures of around 250-350°C, pass through rolls and are prone to scratching due to contact with the roll surface. The felt is placed over the roll and secured by folding and fixing both ends. In many cases, high heat-resistant and high-strength poly(p-phenylene benzobisoxazole) (PBO) fibers are used in the crown section. 【Specifications Example】 ■ Roll Dimensions: φ1500mm × L2100mm ■ Material: PBO / Para-type Aramid ■ Crown Thickness × Width: 5.0mm × 1800mm *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials

"THERMOTEX(R)" is a heat-resistant felt that helps prevent scratches on delicate aluminum extrusions. Aluminum extrusions gradually cool down from the initial table to the run-out table, cooling table, and sorting table, so we offer a lineup of felts made from various types of fibers to match the temperature and transport conditions of the aluminum extrusions. [Product Forms] ■ Tube ■ Endless Belt ■ Pad *For more details, please download the PDF or feel free to contact us.

• Other polymer materials

"ACE BOARD(R)" is a high-performance heat-resistant cushioning material made of high-temperature resistant fibers. It is widely used in the production of printed circuit boards for smartphones and various other high-temperature pressing applications. 【Features】 ■ A wide range of options tailored to temperature ranges and required cushioning properties ■ Maintenance of cushioning properties: long life, reduction of waste ■ Non-gas: no generation of harmful gases *For more details, please download the PDF or contact us. Samples are also available.

• Other polymer materials