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The "Vacuum Sealing Device" can perform various bonding and sealing processes for devices that need to be assembled at the chip level, such as semiconductors and electronic components. It supports the development and mass production of bonding processes including eutectic bonding, soldering, thermal compression bonding, and various diffusion bonding. Since the workpiece can be uniformly heated and pressurized, good sealing can be achieved. 【Features】 ■ Capable of sealing various sizes in the 4 to 6-inch square range (100 to 150 mm) ■ Good sealing can be achieved due to uniform heating and pressurization of the workpiece ■ Development of an ideal heating and cooling control system ■ Capable of controlling any pressure from vacuum to pressurized atmosphere *For more details, please download the PDF or feel free to contact us.
