Manufacturing and processing contract
セラケン
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Our company provides precision processing services for hard and brittle materials such as sapphire, ceramics, quartz glass, magnetic materials, and crystals, with the motto of "thinner, smaller, and higher precision." We boast a minimum thickness of 20µm for thin films, a minimum of 200µm for cutting and shaping, and a polishing roughness of 0.1nm. Additionally, we can accommodate basic processing methods such as cutting, polishing, rounding, slicing, and drilling. 【Supported Materials】 ■ Crystalline materials: Sapphire, quartz, silicon, and other crystals ■ Ceramics: Alumina, zirconia, silicon carbide, silicon nitride, boron carbide ■ Functional ceramics: Barium titanate, zirconium titanate, and others ■ Magnetic materials: Ferrite, neodymium, samarium cobalt ■ Hard and brittle materials: Glass, quartz, and others ■ Metal components: SUS, cemented carbide, etc. *For more details, please feel free to contact us.
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