村谷機械製作所 Product Lineup

Our company, engaged in the manufacturing and sales of machine tools and industrial machinery, has developed numerous automation equipment for handling, positioning, processing, assembly, and inspection, targeting materials such as metals, resins, liquids, paper, and semiconductors. We conduct business with companies in sectors such as machining, electronic components, semiconductor manufacturing, and medical devices. All of our products are custom machines designed with the concepts of "precision" and "labor-saving." We offer "integrated contract manufacturing," which encompasses everything from process development to device concept and design production, as well as "OEM manufacturing" based on customer design specifications. Additionally, we also produce general-purpose machines for mass production according to customer needs. 【Business Activities】 ■ Manufacturing and sales of machine tools and industrial machinery *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• Processing Contract

Laser cladding (build-up welding) is a laser processing technology that uses powdered materials as raw materials and forms a coating by heating and welding with laser light. 【Features】 ■ NC Controller - Equipped with a 5-axis moving stage - Controlled by NC code ■ High-precision Metal Powder Feeder - Standard equipped with a monitoring device for supply amount - Provides stable metal powder supply through feedback control ■ Multi-beam Direct Semiconductor Laser - Simultaneously emits multiple laser beams - High efficiency, low cost *For more details, please download the PDF or feel free to contact us.

• Other processing machines

Our company is engaged in the application development of various welding equipment using the "Multi-Beam Direct Diode Laser," which is gaining attention as a compact and high-output laser for processing. It boasts an energy conversion efficiency that is 5 to 30 times higher compared to CO2 lasers and YAG lasers, achieving excellent energy-saving performance. 【Features】 ■ High thermal absorption rate: Due to its short wavelength, it has a low reflectivity and high thermal absorption rate, enabling high-speed processing and low-power energy-saving processing. ■ Compact and lightweight: The head is lightweight, allowing for integration into a variety of applications. ■ Maintenance-free: No complicated adjustment work is required, reducing the burden on operators. *For more details, please download the PDF or feel free to contact us.

• Laser Components
• Other semiconductors