東光高岳 List of Products and Services

The "HVI-S10000C" is a wide-field, temperature-variable warpage inspection device with a measurement range of 160×136mm that does not require bump removal. Using a confocal method, it eliminates the need for painting or removing components from the sample, achieving high-precision inspection of bump height, coplanarity, and substrate deformation simultaneously. The nano-resolution real scale provided by the Z stage allows for controlled shutter timing, enabling data acquisition at high speed while maintaining accuracy at the Z position. 【Features】 ■ Wide field & high speed ■ No bump removal required ■ No painting treatment required ■ Measurement range of 160×136mm ■ Convection heating type that reproduces the reflow process *For more details, please refer to the PDF document or feel free to contact us.

• Visual Inspection Equipment

This catalog introduces inspection equipment that meets our customers' needs. We feature the "TVI Series," which achieves three-dimensional measurement that follows the state of the circuit board storage in a unique way, and the "CVI Series," which enables high-speed individual board inspection while maintaining high-precision inspection performance. Our products utilize a unique confocal optical sensor, achieving high speed that allows for inline measurement by reducing measurement time. 【Contents Included】 ■ In-tray type inline bump inspection equipment ■ Index type inline bump inspection equipment ■ Inline bump inspection equipment ■ Temperature-variable warpage inspection equipment ■ Multi-beam confocal sensor ■ Three-dimensional sensor specifications *For more details, please refer to the PDF document or feel free to contact us.

• Circuit Board Inspection Equipment