Electronic Components and Semiconductors
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Our company performs die-cutting processes that require positioning for various functional films (such as polarizers, reflective films, lens films, etc.) and printed materials (such as labels, stickers, nameplates, FPC wiring board holograms, and 3D images). We utilize die-cutting machines equipped with positioning functions using image cameras according to customer requests, achieving a precision of ±10mm when cutting requires high accuracy with Pinnacle die types. 【Features】 ■ Dimensional Accuracy - Compatible with Thomson and Pinnacle die types - Achieves ±0.10mm with high-precision Pinnacle die types - Capable of handling complex shapes (consultation required) ■ Positioning Accuracy - Uses die-cutting machines with positioning functions (±0.10mm achievable through image camera alignment) - Position accuracy is measured using a 2D image inspection device. Continuous feedback is implemented for centering. *For more details, please download the PDF or feel free to contact us.
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