Manufacturing and processing contract

キックス

addressOsaka/Matsubara-shi/Bessho 8-10-3
phone072-333-6512
last updated：
キックスlogo

キックス List of Products and Services

1～1 item / All 1 items

Displayed results

Semiconductor-related component contract processing services

Manufacturing of parts using advanced processing techniques such as deep hole machining and grooving!

Our company manufactures various metal and resin parts related to semiconductors, chemical machinery, and stirrers. In particular, we specialize in deep hole machining and have a track record of deep hole machining with a diameter of Φ3 and a depth of 83mm using S45C material. Additionally, we accommodate various machining processes such as groove cutting, large diameter machining, and small diameter machining. Please feel free to contact us. 【Machining Technologies】 ■ Deep Hole Machining ■ Groove Cutting ■ Large Diameter Machining ■ Small Diameter Machining ■ Surface Roughness Machining, etc. *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Contract manufacturing
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration