戸上工業 List of Products and Services

Our company has shipped over 50,000 sets of wrapping plates since its establishment. The applications are diverse, including silicone, glass, quartz, ceramics, and metals, and we have received positive feedback from many users. Please feel free to contact us if you have any requests. 【Features <Material and Processing>】 ■ The material used is spherical graphite cast iron (ductile cast iron). ■ In terms of hardness, we primarily use FCD450 (HB150-180), which is suitable for the rolling state of abrasives during lapping. ■ If requested by the customer, we can also manufacture with higher hardness options such as FCD600 and FCD700. ■ We accommodate various needs for groove types, from standard grid types to diamond patterns and radial concentric circles. ■ Finishing grinding is processed using a horizontal axis rotary grinding machine, among other methods. *For more details, please download the PDF or contact us.

• Wafer processing/polishing equipment

The "KT type" is a 2Way lapping machine developed for the final polishing of small workpieces, adopting a 2Way method where only the sun gear and internal gear rotate respectively. Even during the polishing process, small pieces such as quartz and ceramic chips can be removed for dimensional measurement without raising the upper table, allowing for the extraction of a single piece. 【Features】 ■ High performance not only in workpiece accuracy after polishing but also in reducing friction of machine parts and maintaining the precision of the base plate. ■ We provide lapping plates that have been uniquely researched and developed by our company. ■ Suitable for the final polishing process of quartz oscillators and ceramics. ■ A 3way type 4B machine with a mechanism to rotate the upper table in the 2way method is also available. *For more details, please download the PDF or contact us.

• Wafer processing/polishing equipment