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  2. Electronic Components and Semiconductors
  3. Semi Next 本社、三重事業所
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Electronic Components and Semiconductors
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Semi Next 本社、三重事業所

Establishment2017 year
number of employees1100
addressTokyo/Koto-ku/Ariake 3-7-18, Ariake Central Tower 6F
phone07044264493
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last updated:Jul 15, 2025
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Precision Electronic Measurement Precision Electronic Measurement
High-speed communication test solution High-speed communication test solution
Optical chip test Optical chip test
Power semiconductor testing Power semiconductor testing
Power

Power semiconductor testing

The front-end testing of semiconductors is conducted in the wafer manufacturing process to verify whether the processing parameters meet design specifications after each step, or to check for defects that may affect yield. On the other hand, back-end testing equipment is performed after wafer processing is complete, primarily aimed at conducting electrical characteristic tests to confirm whether the chip's electrical performance meets specified values. Semight provides solutions such as wafer-level burn-in systems for SiC and handlers compatible with Known Good Die (KGD), delivering clear added value to customers in the form of improved testing efficiency and reduced testing costs.

Power device "KGD"

Full testing at low cost! The sealed structure of the probe ensures the safety and reliability of the press.

Our "KGD" is a testing device that performs 4Site parallel testing, capable of conducting static and dynamic tests at both room temperature and high temperature. The UPH is high, ranging from 1000 to 1200, with high testing efficiency, significantly reducing testing costs. It also supports various LD/ULD boxes. The sealed structure of the probe ensures the safety and reliability of the inspection. 【Features】 ■ Compatible with various LD/ULD boxes ■ Temperature range RT-200°C (optional -45°C) ■ Supports 3000V/1200A ■ Capable of full testing with 4Site parallel testing and static + dynamic tests ■ Specially designed circuits guarantee circuit inductance of less than 15nH *For more details, please refer to the PDF document or feel free to contact us.

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PB6800 SiC KGD die handler

Overwhelming mass production capability at 4000 UPH. Automatic for dynamic, static, and high-temperature conditions.

The Semight PB6800 is a high-end SiC KGD die handler widely adopted in the semiconductor industry. It is specialized for dynamic and static parameter testing at the bare die level of SiC power chips, achieving high-reliability KGD (Known Good Die) sorting. This system employs a modular design and supports various die supply methods, including frame rings, tape & reel, and trays. Additionally, it allows for hard docking connections and testing at multiple stations at both room temperature and high temperature, and it is equipped with high-voltage arc protection features. It is a solution that significantly contributes to improving testing efficiency and yield in the mass production process of SiC power devices.

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Announcement of Participation in "SEMICON JAPAN 2025"

Test solutions for CPO and semiconductor WAT/reliability evaluation solutions are the key points!

We will be exhibiting at 'SEMICON JAPAN 2025' held at Tokyo Big Sight. This exhibition covers manufacturing technologies, equipment, and materials in the semiconductor industry, as well as SMART applications such as vehicles and IoT devices, making it an international exhibition for electronics manufacturing. Highlights of our booth products include "Test Solutions for CPO," "Semiconductor WAT/Reliability Evaluation Solutions," and "KGD/Wafer Aging Tests for Power Semiconductors." We sincerely look forward to your visit. 【Event Overview】 ■ Date: December 17 (Wed) to 19 (Fri), 2025, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Booth Number: W3232, West Hall 3rd Floor ■ Pre-registration for attendance is required. *For more details, please feel free to contact us.

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