Electronic Components and Semiconductors
ヤマザキテクノ

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Our company handles parts processing. In particular, we specialize in processing SUS materials and are capable of NC lathe and M/C processing for diameters ranging from φ20 to φ400. We have been manufacturing various polishing devices for substrates (wafers), as well as lap and polish devices and inner and outer diameter edge polishers for hard disks for many years. Recently, we have started manufacturing edge polishing devices for cover glass used in touch panels for smartphones and tablet PCs. Additionally, we are involved in the design and production of labor-saving devices, general industrial machinery, and tools, as well as the manufacturing of sheet metal working machines for air conditioning ducts. 【Machinery Equipment】 ■ INTEGREX j-200 ■ QTN-350II ■ QSM-200L, etc. *For more details, please download the PDF or feel free to contact us.
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