ハポイン List of Products and Services

1. Thermal conductivity > 170 W/m·k; it has thermal conductivity more than 7 times that of alumina and superior mechanical strength compared to alumina. 2. High electrical insulation, low dielectric constant, and low dielectric loss. 3. It has a thermal expansion coefficient close to silicon, achieving high reliability for mounting large silicon chips and thermal cycling. 4. It shows good corrosion resistance to molten metals. 5. It contains extremely low levels of impurities, is non-toxic, and has high purity. Product applications: Heat dissipation substrates, substrates for LED packages, substrates for semiconductors, thin-film circuit substrates, substrates for power resistors. Aluminum nitride ceramic substrates; Zirconia ceramic substrates; Silicon nitride ceramic substrates; Electrostatic chucks; Ceramic mechanical fingers; A manufacturer focusing on the research, development, and production of industrial precision ceramics and precision ceramics!

• Fine Ceramics

1. Material specifications: Alumina content 92%, 96%, 98%, 99%, 99.5% 2. Craft type: Laser scribing, die punching 3. Thickness range: Thinnest 0.2mm, thickest 3.0mm 4. Length and width range: Maximum length 420mm, maximum width 240mm 5. Hole diameter range: Minimum hole diameter φ0.07mm 6. Product applications: Heat dissipation substrates for electronic components, high-power circuit boards used in industries such as automotive, copper-clad laminates, printers 7. Product advantages: It has good thermal conductivity and thermal shock resistance. Surface characteristics and flatness are excellent, with high dimensional accuracy. It has high insulation performance, with low dielectric constant and dielectric loss. Physical and chemical properties are stable. It possesses excellent mechanical strength. It has corrosion-resistant properties. Aluminum nitride ceramic substrates; Zirconia ceramic substrates; Silicon nitride ceramic substrates; Electrostatic chucks; Ceramic mechanical fingers; A manufacturer focusing on the research, development, and production of industrial precision ceramics and precision ceramics!

• Fine Ceramics

The "MID-D350FHSD" is a high-efficiency, online integrated selective automatic soldering device capable of mass production. The jet module and soldering module can be selected as single or double, and it allows for adjustable jet height, internal visualization, and camera programming. Additionally, the two soldering pots can move independently on a single axis (Y/X) across the entire series, enabling both soldering pots to perform soldering within their range of motion. 【Features】 ■ High efficiency and capable of mass production ■ Jet module can be selected as single or double ■ Soldering module can be selected as single or double ■ Adjustable jet height, internal visualization, and camera programming available ■ High flexibility in module combinations, allowing for module customization *For more details, please download the PDF or feel free to contact us.

• Soldering Equipment

The "MID-D350FHSD" is a high-efficiency, mass-production capable online integrated selective automatic soldering device. The jet module and soldering module can be selected as single or double, with adjustable jet height, internal visualization capabilities, and programmable cameras. Additionally, the two solder pots can move independently on a single axis (Y/X) across the entire series, allowing both solder pots to perform soldering within their range of motion. 【Features】 ■ High efficiency and capable of mass production ■ Jet module can be selected as single or double ■ Soldering module can be selected as single or double ■ Adjustable jet height, internal visualization capabilities, and programmable cameras ■ High flexibility in module combinations and customizable modules *For more details, please download the PDF or feel free to contact us.

• Soldering Equipment

Our company is engaged in the research and design of semiconductor devices, as well as providing technology for SMT devices. Our business divisions include the Electronic Assembly Division, the Semiconductor Division, and the Research and Development Division. We also handle electronic assembly products such as solder paste, flux, BGA rework, and selective soldering equipment. 【Business Divisions】 ■ Electronic Assembly Division ■ Semiconductor Division ■ Research and Development Division *For more details, please download the PDF or feel free to contact us.

• Soldering Equipment
• Other semiconductor manufacturing equipment

This document introduces the products related to "precision ceramics" that we handle. It features "plasma-resistant components" known for their high plasma corrosion resistance, as well as "semiconductor chamber structural components" and "porous ceramic vacuum chucks/carriers." Additionally, we also introduce "alumina ceramic substrates," which have excellent surface characteristics, smoothness, and dimensional accuracy, along with their features and photos. [Featured Products (Partial)] ■ Electrostatic chucks ■ Plasma-resistant components ■ Semiconductor chamber structural components ■ Porous ceramic vacuum chucks/carriers ■ Alumina ceramic substrates *For more details, please download the PDF or feel free to contact us.

• Ceramics

This document introduces the nozzle specifications for selective soldering equipment. It includes specifications for H47mm nozzles, as well as H65mm, H70mm, and H75mm nozzle specifications. Additionally, it also features H80mm and H85mm nozzle specifications. Please feel free to download and take a look. 【Contents】 ■H47mm nozzle specification ■H65mm nozzle specification ■H70mm nozzle specification ■H75mm nozzle specification ■H80mm nozzle specification ■H85mm nozzle specification *For more details, please download the PDF or feel free to contact us.

• Soldering Equipment