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We provide reverse engineering (teardown) services for circuits and printed circuit boards, leveraging the experience and analytical evaluation techniques cultivated through the development of various products such as home appliances, industrial equipment, and automotive applications. Our reverse engineering at the Product Analysis Center can be utilized not only for investigating competitor products but also for developing superior products in terms of performance, quality, and cost, as well as identifying and resolving the causes of failures in ODM products. We have over 100 successful cases to date. 【Features】 - Accurate component identification from unique perspectives - Decoding hidden information from printed circuit board patterns and restoring it to easily understandable circuit diagrams 【Applications】 - Competitor benchmarking and cost analysis - Idea extraction for new product development - Investigation of failure causes in ODM products - Response to EOL (end of life) situations *We can discuss the analysis details while addressing your concerns. Please feel free to contact us.
