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"DOWSIL(TM) TC-4525 CV" is a two-component, room-temperature curing thermal silicone gap filler. It is made of a soft, compressible material designed to dissipate heat from electronic components mounted on printed circuit boards to heat sinks once cured. It cools modules such as engine and transmission control units. It is designed for smooth production processes and is suitable for two-component metering, mixing, and automatic dispensing equipment. 【Features】 - Room temperature curing - Long-term stability in thermal cycling tests below 150 degrees C - Low compressive stress - Good vertical hold (both cured and uncured) - Low molecular siloxane reduction product *For more details, please download the PDF or feel free to contact us.
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The "DOWSIL(TM) EA-4700 CV Adhesive" is a two-component, room temperature curing adhesive that provides durable bonding to common substrates used in automotive electronic devices. It also supports heat-accelerated curing, and heating does not cause voids to form, which accelerates the manifestation of adhesion. It can be applied using standard dispensers. With a 600% elongation, it is suitable for large modules. It is a low molecular siloxane-reduced product that demonstrates stable performance under standard operating conditions (150°C, thermal shock, 85°C/85% RH). 【Features】 ■ Durable bonding to common substrates for automotive electronic devices (aluminum, PBT, PPS, etc.) ■ Room temperature fast curing or heat-accelerated curing ■ Low molecular siloxane reduction ■ No voids formed even when heated ■ 600% elongation *For more details, please download the PDF or feel free to contact us.
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