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We would like to introduce our "Inkjet Printing System," which achieves high image quality through the advanced technology integration developed by our company. We provide a system that can be incorporated into the workflows and equipment of existing customers, enabling the easy implementation of high-speed, high-quality inkjet printing. The system is designed with flexibility, scalability, and modularity, allowing it to integrate without changing existing workflows, web portals, or finishing equipment. [Provided Contents] ■ Print Box ■ Print Controller Cabinet ■ Maintenance Services & Consumables *For more details, please download the PDF or feel free to contact us.
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Free membership registrationWe have developed an "Inkjet Printing System" that achieves high image quality through advanced technology integration. We provide a system that can be incorporated into the workflows and equipment of existing customers, enabling easy implementation of high-speed, high-quality inkjet printing. The system is designed with flexibility, scalability, and modularity, allowing it to integrate without changing existing workflows, web portals, or finishing equipment. Additionally, we have developed a "Photo Printing System" equipped with a box-type print engine. Please feel free to contact us if you have any inquiries. 【Provided Content】 ■ Print Box ■ Print Controller Cabinet ■ Maintenance Services & Consumables *For more details, please download the PDF or feel free to contact us.
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Free membership registrationThe "G5AN/G5HN" is an air-cooled UV LED light source with a nitrogen purge model that dramatically improves ink versatility. The "G5AN" achieves printing speeds more than five times faster (※1) compared to non-LED compatible inks without nitrogen, while the "G5HN" offers even higher curing performance with a greater accumulated light dose. (※1: Kyocera test results) With a center wavelength of 385±5nm and an irradiation distance of 0mm, the accumulated light dose for the G5AN is 270mj/cm2, and for the G5HN, it is 400mj/cm2, with peak illuminance of 24W/cm2 for both. 【G5AN Specifications (Partial)】 ■ Cooling method: Air cooling ■ External dimensions (excluding protrusions): W80.3mm × D109.7mm × H161.2mm ■ Weight: 1.3kg ■ Power consumption: 0.56kW ■ Recommended nitrogen purity: 99.9% or higher (depending on the ink used and printing conditions) *For more details, please refer to the PDF document or feel free to contact us. *The data on this page is based on Kyocera's research as of October 2021, unless otherwise noted.
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Free membership registrationThe "G5AP" is an air-cooled UV LED light source that achieves space-saving and high output. The width of the thinnest part, excluding the fan section, is designed to be ultra-thin at 19mm. This enables compact equipment and high design flexibility. In the case of inkjet printing, placing the G5AP between colors prevents ink bleeding and color mixing, contributing to improved print quality. When the center wavelength is 385±5nm, the peak illuminance immediately after lighting is 6W/cm² at an irradiation distance of 0mm, with a power consumption of 0.17kW and a weight of 0.5kg. 【Specifications (partial)】 ■ Cooling method: Air cooling ■ External dimensions (excluding protrusions): W120.0mm × D19.0mm × H219.0mm ■ Weight: 0.5kg ■ Power consumption: 0.17kW ■ Interlock: Temperature abnormality, current abnormality, airflow abnormality *For more details, please refer to the PDF document or feel free to contact us. *The data on this page is based on Kyocera's research as of October 2021, unless otherwise noted.
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Free membership registrationThe "G5H" is an air-cooled UV LED light source that achieves the highest class of cumulative light output in the industry (※2). (※2: Based on comparisons with publicly disclosed light output values of other manufacturers. Kyocera research.) It achieves a high cumulative light output of 400mJ/cm² (※1). (※1: At wavelengths of 385nm/395nm and a transport speed of 50m/min.) When the center wavelength is 385nm + 5nm, the peak illuminance immediately after lighting is 24W/cm² at an irradiation distance of 0mm. The power consumption is 0.86kW, and the weight is 1.5kg. 【Specifications (partial)】 ■ Cooling method: Air-cooled ■ External dimensions (excluding protrusions): W80.3mm × D140.0mm × H170.5mm ■ Weight: 1.5kg ■ Power consumption: 0.86kW ■ Interlock: Temperature abnormality, current abnormality, airflow abnormality *For more details, please refer to the PDF document or feel free to contact us. *The data on this page is based on Kyocera research as of October 2021, unless otherwise noted.
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Free membership registrationThe "G5A" is an air-cooled UV LED light source that achieves high brightness while being compact and lightweight. It achieves a high brightness of 24W/cm² (*1) with a compact size (80.3×88.0×150.5mm) and a lightweight design (1.0kg). (*1: For wavelengths of 385nm/395nm) Despite its high brightness, it uses an air cooling method, eliminating the need for a chiller unit, thereby reducing initial equipment investment. The power consumption is 0.56kW, and the weight is 1.0kg. 【Specifications (partial)】 ■ Cooling method: Air cooling ■ External dimensions (excluding protrusions): W80.3mm×D88.0mm×H150.5mm ■ Weight: 1.0kg ■ Power consumption: 0.56kW ■ Interlock: Temperature abnormality, current abnormality, airflow abnormality *For more details, please refer to the PDF document or feel free to contact us. *The data on this page is based on Kyocera's research as of October 2021, unless otherwise noted.
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Free membership registrationWe would like to introduce the 'UV LED Light Source' that we handle. Our lineup includes the "G5A," which achieves high brightness of 24W/cm² (*), the "G5H," which achieves a high cumulative light amount of 400mJ/cm² (*), and the nitrogen purge model "G5AN." (*) Under the conditions of wavelength 385nm/395nm and transport speed of 50m/min. For products with high brightness and high cumulative light amounts, please leave it to us. 【Features of Kyocera UV LED Light Sources】 - High heat dissipation and high-density mounting achieved with in-house ceramic substrates - Product design utilizing simulation technology - Flexible support through custom design 【Application Examples】 - Sheet-fed offset printing - Inkjet printing - Other analog printing - Coating - Adhesive - Exposure devices *For more details, please refer to the PDF materials or feel free to contact us. *The data on this page is based on Kyocera's research as of October 2021, unless otherwise noted.
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Free membership registrationKyocera has developed UBM formation technology using electroless plating, cultivated in its own printer device processes, and it supports Ni-Pd-Au. We can provide a comprehensive service from solder bump formation, back grinding, dicing, to taping, so please feel free to contact us when needed. 【Features of Kyocera's Electroless UBM Plating】 ■ Support from a single prototype ■ Realization of shortened lead times (as short as 1 day) ■ Quality assurance through automatic visual inspection of all wafers and terminals ■ Long-term stable supply guaranteed due to in-house device processes ■ Compatible with 4/5/6/8 inch wafers *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationKyocera utilizes the technologies cultivated through mass production of various devices to provide a range of functional thin film development products. <An example of high-performance thin film development products> - Conductive thin film (Al) A functional conductive thin film that excels in high current resistance (migration resistance), has heat resistance, and also offers excellent processability (etching). - Lead-free ferroelectric thin film (BaTiO3) A compound with a perovskite structure. A lead-free ferroelectric ceramic thin film that exhibits a rapid increase in dielectric constant near the Curie point of 120°C. - Shape memory alloy thin film (Ti-Ni) A shape memory alloy thin film that has a large amount of work per unit volume and can be applied to micro-actuators and other devices. - Pulse-resistant heating thin film (Ta-based, etc.) A heating thin film with a thickness of about 300 angstroms, which excels in pulse resistance and has good processability (etching), with excellent distribution characteristics.
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Free membership registrationKyocera utilizes the technologies cultivated through mass production of various devices to provide a range of developed functional thin films. <An example of a high-performance thin film development product> - Piezoelectric (PZT) thin film A piezoelectric thin film capable of controlling minute displacements. - Thermistor thin film (Cr-Al) A thin film with thermistor characteristics that allows for fine temperature control while measuring, with appropriate resistance value changes due to temperature. - High hardness thin film (SiC, diamond-like carbon: DLC) A high hardness thin film with good adhesion, produced by low-temperature film formation below 250°C, which is gentle on the substrate and tailored for specific applications. - Photocatalytic thin film (TiO2) A thin film with the ability to decompose organic substances when exposed to ultraviolet light.
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Free membership registrationThe "KJ4 Series" is an inkjet print head that can simultaneously achieve high-speed printing, high resolution, and grayscale printing. It features a wide printing width of 108mm, covering a large printing area with a small number of heads. Additionally, its unique flow path design technology ensures stable ink supply to all 2,656 nozzles. We offer models designed for relatively high-viscosity inks such as UV-curable inks, including the "KJ4A Series," as well as the "KJ4B Series" and "KJ4C Series." 【Features】 ■ 108mm wide printing width ■ Covers a large printing area with a small number of heads ■ Simultaneously achieves high-speed printing, high resolution, and grayscale printing ■ Continuous printing stability ■ Stable ink supply to all 2,656 nozzles due to unique flow path design technology *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationOur "Thermal Print Head" supports both face-down bonding method, which combines high reliability and high productivity with a drive IC mounting method, and wire bonding method, which enhances design flexibility. We can flexibly customize to meet various requests. Thanks to our in-house integrated production system, we can adapt to various applications by selecting from a wide range of glaze shapes, resistance values, and types of protective films. 【Features】 ■ Supports face-down bonding method and wire bonding method ■ In-house integrated production system from the core material, ceramic substrate, to the completed head ■ Adaptable to various applications through a wide selection of glaze shapes, resistance values, and types of protective films ■ The head shape can also accommodate flat types, edge types, corner edge types, and peripheral component mounting such as brackets according to requests *For more details, please refer to the related links or feel free to contact us.
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