Electronic Components and Semiconductors
日野エンジニアリング

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Currently, our company is developing a standard CPU module "MF-CPU-8M Plus" equipped with NXP's "i.MX8MPlus." Utilizing the technology unique to Hino Engineering, which specializes in camera modules, we are implementing drivers for image sensors and leveraging the ISP integrated into the "i.MX8MPlus" to connect with various image sensors. This eliminates the need for a separate ISP, enabling cost reduction and miniaturization of the circuit board size. We have already completed the driver development for several SONY sensors, and the standard board is equipped with various interfaces. Of course, we can also accommodate specification changes (customization) according to customer requests (*). *Additional development costs will apply. If you have any questions or inquiries, please feel free to contact us through our company website! Hino Engineering HP (Contact): https://www.hinoeng.co.jp/?page_id=20
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