オプトピア List of Products and Services

We offer a processing service that can drill high-quality and high-speed holes in glass substrates. By combining glass modification using ultra-short pulse lasers with a chemical etching process, we achieve both high quality and fast processing. We can also perform shape cutting without chipping, and drilling of free-form shapes without tapering is possible. 【Features】 ■ Drilling of free-form shapes without tapering is possible thanks to ultra-short pulse lasers and our unique etching technology. ■ Shape cutting can be done without chipping. ■ High quality and high-speed processing are achieved. * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines
• Circuit board processing machine
• Processing Contract

The "LSL-100F/VOLCANO LB750-4" is a device that peels off polymer films such as polyimide coated on glass substrates using a laser. By adopting a line beam optical system, it enables a high-quality and high-speed LLO process. The use of solid UV lasers as the light source achieves significant cost reduction. Additionally, it accommodates a range of devices from compact, low-cost LLO systems to large systems for G6 panels. 【Features】 ■ High-quality and high-speed LLO process enabled by adopting a line beam optical system ■ Solid UV lasers used as the light source ■ Significant cost reduction achieved ■ Compatible with both compact, low-cost LLO systems and large systems for G6 panels * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines
• Circuit board processing machine

The "LSL-40/100" is a compact and low-cost device that uses a solid-state UV pulse laser and our unique optical design to irradiate a uniform line beam onto the substrate, allowing for the LLO process to be performed across the entire surface of the substrate by moving the workpiece on a stage. By adopting a new type of laser, the quality of LLO has significantly improved. It can be used with just a power supply. 【Features】 ■ Compact and low-cost (movable with casters) ■ Usable with just a power supply ■ Class 4 safety measures (light path sliding part shielding and interlock safety circuit) ■ A demo unit is also available for your consideration of the device *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

This device uses a solid-state UV pulse laser to create a uniform line beam through our unique optical system, and it is designed to separate devices from substrates by moving the substrate on a stage. The separated substrates and devices are collected in a tray by a robotic arm. 【Features】 ■ Achieves a stable separation process with a uniform intensity line beam using a solid-state laser ■ No need for auxiliary equipment such as toxic gas, resulting in low cost and low running costs ■ Compatible with large substrates (515mm x 510mm) *For more details, please download the PDF or feel free to contact us.

• Other processing machines

The "LSL-10" is an experimental device that forms a line beam using a solid-state UV pulse laser and moves the substrate on the workpiece with a stage to perform the LLO process across the entire surface. LLO allows for instantaneous delamination at the interface through laser irradiation using substrates that transmit laser light, such as glass and sapphire. This device is compact, low-cost, and can be moved using casters. It implements Class 4 safety measures. 【Features】 ■ Compact and low-cost (movable with casters) ■ Can be used with only an AC100V power supply ■ Class 4 safety measures (light path/sliding part shielding, interlock) *For more details, please refer to the PDF document or feel free to contact us.

• Laser Components
• Optical Experimental Parts
• Other optical parts