サイレックス・テクノロジー List of News Articles

While the demand for wireless communication is increasing in the industrial market, concerns about stability and reliability remain strong. In this seminar, we will welcome Mitsubishi Electric and explain the challenges of wired environments in the industrial market and the solutions through the use of wireless technology from both technical and practical perspectives.

Silex Technology Inc., a global leader in wireless technology (headquartered in Seika, Kyoto Prefecture, President: Nobuhiko Miura, hereinafter referred to as Silex), will launch the multi-OS compatible wireless screen transfer system "Z-1 Gen2" as the core product, along with related products "AMC Cast" and "ST-10 E model," to advance the use of ICT in educational settings to the next stage. Additionally, the Windows projection tool "AMC Meeting" will be upgraded with new features.

In the wirelessization of battery-powered devices, power efficiency and communication stability are crucial. In this seminar, we will welcome an expert from NXP to explain solutions from both chipset and module perspectives. We will also present measurement results using the new product "SX-SDMAX6E," providing practical tips for developers and planners struggling with wirelessization!

Silex Technology Inc., a global leader in wireless technology (headquartered in Seika, Kyoto Prefecture, President: Nobuhiko Miura, hereinafter referred to as Silex), will launch the industrial wireless bridge "BR-600AX," compatible with three frequency bands of 2.4GHz, 5GHz, and 6GHz, on October 15, 2025.

Notice of AMC Blog Update The blog "AMC Blog" by the product planning team has published an article titled "Unauthorized APs (Rogue APs) Disrupting the Network: Visualizing with AMC Cloud to Enhance Security!" https://www.silex.jp/library/AMC-blog/20250825

Silex Technology Inc. (Headquarters: Seika-cho, Kyoto Prefecture, President: Nobuhiko Miura, hereinafter referred to as Silex), a global leader in wireless technology, has announced the "SX-SDMAX6E," an embedded wireless LAN module equipped with the world's first NXP(R) Semiconductors chipset "IW623" for Wi-Fi 6/6E.

We are currently seeking companies to collaborate on a Proof of Concept (PoC) to verify the practicality of use cases where the EP-200Q is expected to be utilized in Edge AI devices. As a special benefit, we are offering the Evaluation kit 'EP-200Q-EVK' for free.

Silex will be exhibiting at "Wireless Japan 2025," one of Japan's largest wireless communication events, held from May 28 (Wednesday) to May 30 (Friday) at Tokyo Big Sight, South Hall 3 and 4. We plan to showcase our 802.11ah (Wi-Fi HaLowTM) products, dynamic demonstrations, and participate in seminars. We sincerely invite you to attend Wireless Japan 2025, where the latest technologies of 802.11ah will be gathered.

On June 17, 2025 (Tuesday) at 2:00 PM, we will hold an online seminar titled "Wi-Fi 7 Innovations: The Latest Wi-Fi Integration Guide for Wireless Device Development." This seminar aims to address the many questions that arise when introducing the latest technologies. We encourage you to participate. (Participation fee: Free)

Silex Technology Inc. (Headquarters: Seika-cho, Kyoto Prefecture, President: Nobuhiko Miura), a global leader in wireless technology providing reliable connectivity, has announced the launch of the Wi-Fi 7 compatible system-on-module 'EP-200Q' for industrial edge AI applications, equipped with the Qualcomm(R) Dragonwing(TM) QCS6490.

Silex will be participating in the "IoT & Edge Computing EXPO [Spring]" held at Tokyo Big Sight from April 23 (Wednesday) to April 25 (Friday), with the theme "Connected, Visible, and Beyond." We plan to showcase a hands-on demonstration of new Silex technologies, including stable video communication and positioning using the 6GHz band, in an exhibition hall filled with radio waves. We sincerely look forward to your visit.