オー・エイチ・ティー List of Products and Services

1. It can identify the "defective location" of Open/Short, which is difficult to determine with electrical testing. 2. It can detect "dents" that are difficult to identify with optical images. 3. It can detect defects not only in surface patterns but also in internal layer patterns. 4. It allows for dynamic observation as well as static images. 5. Since it detects electrical differences, it is less affected by dirt (insulators).

• Circuit Board Inspection Equipment

We provide a completely new inspection system that combines the advantages of highly reliable electrical testing without over-detection and the benefits of optical inspection capable of pattern recognition and localization. If you have any issues with inspections, please feel free to contact us.

• Other electronic measuring instruments
• Circuit Board Inspection Equipment

The completely non-contact inspection device "GX3" is a fully non-contact inspection device for large PDP and LCD panels that does not damage the electrode patterns. It is capable of ultra-fine pattern inspection and boasts the industry's highest speed. It is compatible with the 8th generation. There are no scratches on the patterns, and no particle generation occurs. The possibility of misjudgment due to dust or debris adhering to the patterns is extremely low. There are no running costs. For more details, please download the catalog.

• Other inspection equipment and devices

The non-contact inspection device reel-to-reel inspection system "TRV" is a non-contact inspection device reel-to-reel inspection system compatible with TAB/COF/TCP/TBGA. The inspection stage can move up and down independently and is driveable. This mechanism allows for precise positioning relative to the target location and stable inspection. Equipped with dual-camera CCD, it enables correction along the X, Y, and φ axes for high-precision alignment. Additionally, it has achieved a 30% increase in inspection speed compared to conventional methods, enabling high-speed inspection and transportation. Our unique non-contact inspection method does not damage the fine terminal parts of IC bonding pads. It can transport without using any sprockets. The tension-free structure prevents damage to the tape. It employs an optimal transportation method for thin and thick tapes. For more details, please download the catalog.

• Other inspection equipment and devices