- Publication year : 2025
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From January 22 to 24, 2025, we exhibited at the "Nepcon Japan Power Device & Module EXPO" held at Tokyo Big Sight. At this exhibition, we introduced our vertically oriented high thermal conductivity TIM, "Zebro," focusing on its features. Zebro is a highly durable material that does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for long periods while maintaining a stable low thermal resistance, making it a reliable heat dissipation material. With the increase in heat generation due to improved semiconductor performance and the miniaturization of devices, the efficiency of thermal management has become a significant challenge. Zebro can be utilized in applications that efficiently dissipate and cool heat generated by electronic components such as power semiconductors supplying high current and high voltage, as well as high-brightness and high-output LEDs/LDs. For those seeking TIMs with good thermal conductivity or facing challenges with insufficient cooling from conventional heat dissipation materials, we offer a variety of thermal management solutions tailored to meet your needs, in addition to Zebro. If you are interested, please feel free to contact us.
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Free membership registrationWe will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!
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Free membership registration39th Nepcon Japan (2nd Power Device & Module EXPO) We propose the vertically oriented high thermal conductivity TIM "Zebro." 【Dates】January 22 (Wednesday) - 24 (Friday), 2025 【Venue】Tokyo Big Sight, East Hall 7, Booth No.: E69-20 Please register as a visitor via the URL below and be sure to visit our booth! Just apply pressure (surface pressure), and incredible thermal measures are here! With high durability, there is no degradation of properties due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs.
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