Are you having trouble procuring O-rings and various seal packings made in Japan or overseas?

Are you having trouble sourcing O-rings and various seal packings made domestically or overseas?

While there are calls for a shortage of rubber raw materials, fluororubber (FKM) and silicone rubber (Si) are gradually becoming available, and we are also supplying a significant amount of EPDM and other materials that are being viewed as problematic in terms of supply. 【Delivery Achievements: Products for Electronics and Semiconductors】 - Heat-resistant and chemical-resistant O-rings (FFKM) - Seals for semiconductor manufacturing equipment/analysis testing equipment - Seals for mass flow controllers (FKM/NBR/EPDM/CR) - Seals for vacuum plasma equipment (NBR) If you are having trouble procuring O-rings or various sealing gaskets, please feel free to contact us, as we can manufacture them through a dual production system!

• Rubber mold
• Rubber

Features: ● Equipped with ARM MediaTek Genio 700 / 510 ● Onboard LPDDR4 8GB ● HDMI 2.0 x 1, DP 1.4 x 1 ● eDP 2 lanes x 1, MIPI-DSI 4 lanes x 1 ● GbE x 1 ● USB 3.0 + 2.0 x 1, USB 2.0 x 5 ● UART x 4, GPIO x 12, MIPI CSI x 2, TPM 2.0 ● Fan-equipped heatsink, heatsink available separately ● Carrier board available separately

Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)

By digitizing contract operations, you can reduce many costs, including stamp duty and mailing fees. ◆ Four Benefits of Electronic Contracts - Cost reduction for printing, stamp duty, mailing fees, and original document storage - Improved business efficiency through system-based sending and stamping - Prevention of tampering with timestamps - Enhanced document searchability 【Many Benefits for the Other Party as Well!】 - Both parties can confirm that the document has not been tampered with - No worry about losing the original paper documents - Increased operational efficiency due to the absence of mailing and binding hassles - Quick contract conclusion through email or system verification ◆ Disadvantages of Electronic Contracts - Costs for implementing and operating the service - Need to ensure that business partners understand electronic transactions ----------------------------------------------------- 　　Consult with paperlogic for electronic contract services! -----------------------------------------------------

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!