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High-performance check screening! Suitable for both wet and dry applications.

The overall height is less than half that of conventional screening devices, making it suitable for safely screening powders and liquid slurries at high capacity. In particular, it is ideal when space is limited, and all oversized contaminants are removed from the product, allowing for safe use. Operation and maintenance can be performed quickly and easily, making it perfect for all processing industries. 【Features】 ■ Increases product purity ■ Increases production volume ■ Reduces equipment downtime ■ Reduces dust and volatile substances ■ Lowers noise levels *For more details, please refer to the PDF document or feel free to contact us.

• Sieve/Shaker

Significantly reduce wastewater treatment costs with a solid-liquid separator. Removes solids from liquids and processes up to 100,000 liters.

Using centrifugal force, solids are removed from liquid slurries. Mesh sizes are available down to a minimum of 20μ. This is helpful for the recovery of fine and valuable resources. Its high versatility makes it highly effective for the separation of all types of liquid slurries. The processing capacity is approximately 100,000 liters per hour. It can handle large volumes, significantly increasing efficiency compared to existing solid-liquid separation machines. Each unit can achieve the capacity of up to three existing solid-liquid separation machines, making it ideal for capital investment.

• Food Processing Equipment

Inline filter optimal for high-temperature liquids, liquid resins, and high-viscosity filtration.

This is a highly versatile device that is ideal for filtering all types of liquids. Its completely sealed structure ensures product quality while protecting the health and safety of workers. The mesh screen sizes are abundant, making it suitable for a wide range of applications. Additionally, the unique SpiroKlene assembly allows for continuous cleaning of the mesh screen, reducing cleaning frequency and downtime. Its reusability also contributes to cost savings. Replacement is easy. It can be quickly removed and installed without any tools.

• filter

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)