Kanto New Factory ★ Birth Announcement ★

★Revolutionary reinforced cardboard★Excellent processability, can be shaped into various forms★By implementing designs tailored to your needs, improvements in logistics processes are possible★

★Revolutionary Reinforced Cardboard "Navi Ace" that Defies Conventional Wisdom★ - Higher strength than regular cardboard - Superior processability compared to typical reinforced cardboard We will solve various problems according to our customers' needs. Introducing the cardboard pallet "Navi Pallet" made from this material. - 2024 Issues - White Logistics - Response to Scope 3 By designing container modules, downsizing packaging materials, and improving work efficiency, we can address the above issues. Of course, this also reduces the labor burden on logistics workers, leading to improved employee retention rates. By leveraging the design capabilities cultivated since the 1950s with our reinforced cardboard "Navi Ace," we can meet the diverse needs of our customers! ↓ For more details, please download the PDF below and consider it ↓

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Light! Strong! Environmentally friendly! The Navi Palette reduces CO2 emissions during logistics. If you are struggling with SCOPE 3 compliance, please consider it.

The lightweight, strong, and environmentally friendly reinforced cardboard "Naviace" is used to create the cardboard pallet "Navipallet," which is effective in reducing CO2 emissions. By using materials with low CO2 emissions and optimizing the design with lightweight materials, we can reduce not only the CO2 emissions from the materials themselves but also the CO2 emissions during transportation. It is possible to reduce not only the transportation emissions under Scope 3 of the supply chain but also the GHG emissions during disposal. There have been many adoption cases by switching from packaging materials such as wooden pallets, plastic pallets, and steel pallets to Navipallets, as well as by enhancing transportation efficiency through improved design. We propose reductions in carbon dioxide emissions during logistics by changing packaging materials and transportation methods for companies working on carbon neutrality and decarbonization. We manufacture Navipallets using recyclable reinforced cardboard in-house. ◎ For more detailed information, please download and view the materials below ◎ Our sales representatives will visit to provide further detailed materials and case studies. Please feel free to contact us.

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★SDGs Carbon Neutral with Naviace★ Doubling Production Facilities★ Enabling more proposals for environmental protection and carbon neutrality, as well as stable supply★

◆In September 2023, we will open a new factory in Itakura Town, Ora District, Gunma Prefecture◆ - Deliveries across the Kanto region will be smoother with the four borders of North Kanto. - With doubled factory equipment, we can ensure a more stable supply. - Deliveries to the Tohoku region, including Fukushima Prefecture, will also be possible. ★Revolutionary corrugated cardboard "Naviace" that overturns conventional wisdom★ - Lower CO2 emissions compared to other materials. - Higher recyclability than other materials. - Superior processability compared to other materials. *Other materials = wood, iron and steel, plastic resin, paper tubes, etc. This will assist your company's efforts in promoting SDGs and carbon neutrality!! ↓↓We would appreciate it if you could download the catalog for more details and consider our offerings↓↓

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Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x1, eDP x1, DP x1, HDMI x1 ● LAN x3, SATA 6Gb/s x1, 8-bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● M.2 2280 M-Key x1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Features: ● Equipped with Intel Core i3-N305 / Processor N97 ● DDR5 4800MHz SO-DIMM x1 slot (up to 16GB) (sold separately) ● LVDS Dual Channel 18/24 bit x1, VGA x1, HDMI x1 ● Intel 2.5GbE x2, SATA 6Gb/s x1, 8bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● Full size mPCIe/mSATA ● M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heatsink included * Memory, storage, and OS sold separately

Features: ● Equipped with Intel Core Ultra 5 225H/7 255H (Arrow Lake) ● DDR5 6400MHz dual-channel SODIMM x 2 (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-key x 1, M.2 3052 B-key x 1, M.2 2230 E-key x 1 ● Supports DC input of 9 to 36V ● Fan-equipped heat sink available separately GENE-MTH6-FAN: Heat sink with fan GENE-MTH6-HSP: Heat spreader (requires heat dissipation in the enclosure) * This model does not include OS/memory/storage.

Ejectors tend to be avoided due to their enormous consumption of compressed air. However, they also have many advantages, such as noise reduction, no heat generation, and no vibrations. When used properly, they can also achieve energy savings. ■ Space-saving, noise reduction, and heat prevention! Goodbye, electric pumps Large ejectors are ideal for replacing electric pumps. Their impact is significant and greatly contributes to improving the environment in manufacturing sites. Moreover, maintenance can be done without tools. For more details, visit: https://www.ipros.jp/catalog/detail/718575

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed without causing any thermal impact on the base material. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.