Data retention of Silicon Power's industrial NAND flash products.

A 2.5-inch SSD equipped with 3D NAND designed for industrial use, capable of supporting large capacities up to 7.6TB, making it an ideal product for a wide range of applications.

Silicon Power 2.5" SATA SSD 【SSD3F0 Series】 • Equipped with high-quality 112-layer 3D TLC NAND flash technology • Supports TRIM command to erase unused data and maintain optimal performance • Achieves superior sustained performance through dynamic SLC caching algorithm • Activates read-only mode when the SSD reaches its write cycle limit to prevent data corruption • Improved product lifespan • Complete protection design with high-reliability industrial-grade integrated active PMU and OVP, OCP, surge removal, and short-circuit protection • External DRAM support for optimal sustained read and write performance • Power shield firmware architecture ensures resistance to power outages • AES256 encryption and TCG Opal 2.0 compliance (available upon request) • Compatible with SP SMART Toolbox Customization specifications are available, so please consult with us. For more details, please contact us through the related link.

• Memory

The DRAMless, BiCS5 NAND equipped PCIe interface SSD MEA3K0E allows for high-speed access and is ideal for industrial applications.

Silicon Power M.2 2242 SSD 【MEA3K0 E Series】 • Equipped with high-quality 3D TLC NAND (BiCS5) flash technology • Compliant with industrial standard NVMe 1.3 and PCIe Gen3x4 • Global wear leveling and detection of initial defective blocks • Supports TRIM, NCQ, DEVSLP commands, and PCIe Gen1.0/2.0/3.0 interfaces • Improved product lifespan • Compatible with SMART Toolbox Customization specifications are available, so please consult with us. For more details, please contact us via the related link.

• Memory

The DRAMless BiCS5 equipped SATAIII interface SSD MDA3K0E supports large capacities up to 1TB, making it ideal for industrial applications.

Silicon Power M.2 2242 SSD [MDA3K0 E Series] • Equipped with high-quality 3D TLC NAND flash (BiCS5) technology • Global wear leveling and detection of initial defective blocks • Supports TRIM, NCQ, DEVSLP commands, and ATA security features • Improved product lifespan • Compatible with SMART Toolbox Customization specifications are available, so please consult with us. For more details, please contact us via the related link.

• Memory

High-performance BiCS5 NAND equipped, M.2 2280 SATA interface SSD for industrial MDC3K0E series.

Silicon Power 2280 SSD [MDC3K0E Series] Equipped with high-quality 3D TLC NAND flash technology • Global wear leveling and detection of initial defective blocks • Supports TRIM, NCQ, DEVSLP commands, and ATA security features • Ensures power failure resistance with power shield firmware architecture • Garbage collection and TRIM dataset management commands • Average P/E cycles through global wear leveling algorithm Customization specifications are available, so please consult with us. For more details, please contact us via the related link.

• Memory

We will clearly explain the basic concepts for understanding the characteristics of each column and strategically selecting the most suitable column for your research and analysis purposes, along with practical selection points. We will also touch on column selection for GC/MS, aiming for a broader acquisition of knowledge. The choice of column is a crucial factor that influences the results of GC analysis. Commercially available columns have various features, such as the type of liquid phase, inner diameter, length, and film thickness. This is an excellent opportunity to deepen your understanding of GC columns, so please take a look.

Publication of a specialized analytical method for ultra-short-chain PFAS analysis, presented at the 59th Annual Meeting of the Japan Society of Water Environment (March 2025)! "Development of an analytical method for ultra-short-chain and short-chain PFAS in drinking water and environmental water using LC-MS/MS."

Tokyo, August 14, 2025 - (JCN Newswire) - Global consulting firm AlixPartners (hereinafter referred to as "the Company") has conducted a survey of industry experts involved in turnaround and restructuring in Asia and has released the latest report titled "2025 Asia Turnaround & Restructuring Survey" (hereinafter referred to as "the Survey"). The results of this survey indicate that, amidst ongoing geopolitical tensions affecting the economic situation, there is an optimistic outlook in Asia regarding global market instability and uncertainty. On the other hand, over 90% of respondents predict that geopolitical turmoil, such as regime changes and conflicts, will lead to an increase in corporate underperformance in the Asia region. Additionally, about 70% believe that global supply chain challenges will worsen over the next year, indicating that as international circumstances become more complex, the impact of such changes on Asian businesses is expanding. URL https://acnnewswire.com/press-release/japanese/101854/

The Changhong Plastic Group Imperial Plastic Co., Ltd. (CHS) will be exhibiting at the "DIY HOMECENTER SHOW 2025," which will be held from Thursday, August 21 to Saturday, August 23, 2025, at the Makuhari Messe International Exhibition Hall in Chiba. 【Venue Address】 〒261-8550 2-1 Nakase, Mihama Ward, Chiba City, Chiba Prefecture Makuhari Messe International Exhibition Hall, Hall 5 Booth: 5B06 At our booth, we will showcase cable ties and wiring devices, presenting a wide range of product offerings. Attendees will have the opportunity to view actual product samples, as well as receive sample catalogs and physical samples we have prepared. Additionally, we have thoughtfully prepared commemorative gifts for visitors, so please be sure to stop by.

In 2024, the market size of Japan's data center network is expected to reach USD 2.22 billion. The IMARC Group forecasts that by 2033, the market size will reach USD 5.88 billion, growing at a compound annual growth rate (CAGR) of 11.40% from 2025 to 2033. The Japanese data center network market is experiencing steady growth, driven by the expansion of cloud adoption, digital transformation, and increasing demand for high-speed connectivity. Government support for 5G deployment and the promotion of AI integration are further boosting market expansion. This report analyzes key trends in each market segment and provides country-specific forecasts for the period from 2025 to 2033. The report is segmented based on components and end-users. It offers a detailed analysis of the competitive environment, highlighting market structure, the position of key players, strategies, a competitive dashboard, and a corporate evaluation quadrant. Email: sales@imarcgroup.com