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  3. バリューエンジン
  4. Seminar on 'Improving Business Efficiency with Office 365 and Smartphone BYOD Measures' held on January 20 (Friday)
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  • Jan 17, 2012
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Jan 17, 2012

Seminar on 'Improving Business Efficiency with Office 365 and Smartphone BYOD Measures' held on January 20 (Friday)

バリューエンジン バリューエンジン
The spread of smartphones has made it a challenge to address BYOD (Bring Your Own Device). By implementing Office 365, a cloud-based groupware, not only can business operations be streamlined, but BYOD measures can also be achieved simultaneously without the need for device management software like MDM. In this seminar, we will explain the features and advantages of Office 365, safety measures and management methods when connecting smartphones, as well as comparisons of using Windows Phone, iPhone, and Android devices with Office 365. Date and Time: January 20, 2012 (Friday) 14:30 - 17:00 (Reception starts at 14:00) Location: Microsoft Japan Co., Ltd. Shinagawa Headquarters 30F 2-16-3 Konan, Minato-ku, Tokyo, Shinagawa Grand Central Tower * 3-minute walk from JR/Keikyu Shinagawa Station Konan Exit Participation Fee: Free Seminar Content: ・Overview and utilization of MS Office 365 (60 minutes)    Break (15 minutes) ・Usage and management methods of smartphones with Office 365 (60 minutes) ・Introduction to implementation and Q&A (15 minutes)
Microsoft Office 365
Microsoft Office 365
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AAEON 3.5-inch standard single board computer equipped with Core 3 N355/N150.

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Features: ●Core 3 N355/N150 ●DDR5 SODIMM x 1 (up to 16GB) ●HDMI 1.4, VGA, LVDS ●2.5GbE x 3, SATA 6Gb/s, GPIO 8-bit ●USB 3.2 Gen 2 x 2, RS-232/422/485 x 2, RS-232 x 2 ●Mini PCIe x 1, M.2 2230 E-Key x 1, M.2 3052 B-Key x 1 ●DC input 9V~36V

Mar 26, 2026

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AAEON Industrial 3.5-inch Standard CPU Board equipped with Intel Core Ultra5/7 Series Processor

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Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, DP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x 1, M.2 2230 E-Key x 1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Mar 26, 2026

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Notice of Participation in Japan IT Week [IoT and Edge Computing EXPO Spring] from April 8 to April 10, 2026.

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Our company will be exhibiting at the "28th IoT & Edge Computing Expo [Spring]" within Japan IT Week, which will be held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday), 2026! We will showcase an AI compact edge PC equipped with NVIDIA's Jetson Thor, boards and PCs featuring Intel's Panther Lake and Bartlett Lake, a vending machine-type demo using ARM boards, as well as touch panel PCs, tablet PCs, and other peripheral devices. ■ Dates: April 8 (Wednesday) - April 10 (Friday), 2026 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the final day) ■ Venue: Tokyo Big Sight, West Hall 3 ■ Booth Location: W22-22 You can register for your visit at the URL below. We sincerely look forward to your attendance. https://www.japan-it.jp/spring/ja-jp/register.html?code=1606569853287533-WSW

Mar 26, 2026

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"Prototype casting, mass production, crack repair" We repair cracks in metal products without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

Mar 26, 2026

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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

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Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Mar 26, 2026

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