Updated the materials for interchangeable rubber collets and interchangeable resin collets. (2024/3/14)

For cost reduction purposes, it is possible to reuse the metal shank and replace only the resin tip with a new one.

Orte Corporation manufactures low-impact resin collets and pickup tools for chip pickup, where even the slightest chip is unacceptable. For resource conservation and cost reduction, we offer a service to reuse metal shanks and replace only the resin tips with new ones. 【Features】 Material: Shank part - SUS Tip part: Can be processed with various engineering plastics such as polyimide, Teflon, and Duracon Minimum hole diameter: 70μm～ *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Leave it to us for collets used in semiconductor manufacturing lines! We can offer a wide variety of extremely small sizes that accommodate the shrinking collets.

In semiconductor manufacturing lines, collets are used. It is recommended to replace the collet with a metal or resin pickup nozzle if there is a risk of scratching the chip surface during die attachment. We offer a wide variety of ultra-small sizes that accommodate shrinking collets. They can be used in conjunction with compatible holders, allowing for easy on-site replacement at a low cost, making them economical. In semiconductor manufacturing lines, it is said that the failure rate of chip movement with standard collets is about 60%. Our products focus on reducing the generation of static electricity when in contact with semiconductors and on the hardness of the materials. Customers who have adopted our products have significantly reduced their failure rate to 1.7%. As a result, we have received many requests for replacements from other materials in recent years. *For more details, please refer to the PDF document or feel free to contact us.*

• Other semiconductor manufacturing equipment
• others

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed