Space-saving! Intuitive operability that is also friendly for new operators! Manual mold press for semiconductor packages, Fusion MEP-30.

The "Fusion-MEP30" is a mold device specialized for prototyping and experimentation.
With low-pressure transfer control, fine adjustments are possible. It features an interactive condition setting screen and a 10-inch touch panel for easy operation from the user's perspective.
As an option, it can accommodate vacuum forming specifications. Please feel free to contact us when you need assistance.
【Features】
■ Plunger cleaning with one-touch operation
■ Added short shot mode
■ Compatible with vacuum forming specifications (optional)
■ Real-time monitoring of resin pressure with internal pressure sensor (optional)
■ Multi-pot (2-5 POT) available for large modules (optional)
*For more details, please refer to the PDF materials or feel free to contact us.
Special site
Related link - https://www.rohm-mechatech.co.jp/

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