Sales of "ToffeeX," which supports the development and design of cooling structure components, have begun - Achieving reduced development time and improved product performance through thermal fluid analysis and topology optimization.
SCSK デジタルエンジニアリング事業本部
SCSK Corporation (Headquarters: Koto-ku, Tokyo, Representative Director and Executive Officer: Takashi Toma, hereinafter referred to as SCSK) has concluded a general agency agreement for the cloud-based topology optimization software "ToffeeX" with ToffeeX Ltd (Headquarters: London, UK) and will begin sales on April 1, 2024. By utilizing advanced topology optimization technology, we will derive the shapes of components that maximize heat dissipation and minimize pressure loss in a short time, thereby achieving reduced development time and improved product performance. We aim to sell 50 units by March 2026, focusing on the manufacturing of components requiring thermal management and the product design field using 3D printing.
*1 Analysis that clarifies how to arrange materials in the design space to achieve an optimal structure.
*2 The energy lost by a fluid as it passes through pipes and other conduits.
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ToffeeX is a topology optimization software based on fluid analysis, featuring high-speed computation, multi-objective optimization, and an intuitive GUI/cloud service (SaaS) as its characteristics.
